Inventor · disambiguated record
Peter Kukanskis
Also filed as: FERRIER DONALD R · KUKANSKIS PETER · KUKANSKIS PETER E
46 granted patents·2 pending applications·1,201 citations·filing 1973–2012
98Inventor score
Top patents by PatentIndex Score
48 records- 0196US4265943AMethod and composition for continuous electroless copper deposition using a hypophosphite reducing agent in the presence of cobalt or nickel ionsMACDERMID INC·Filed 1978·Granted May 5, 1981·338 cites·18 claims
- 0292US4209331AElectroless copper composition solution using a hypophosphite reducing agentMACDERMID INC·Filed 1978·Granted Jun 24, 1980·49 cites·20 claims
- 0390US4279948AElectroless copper deposition solution using a hypophosphite reducing agentMACDERMID INC·Filed 1979·Granted Jul 21, 1981·44 cites·15 claims
- 0488US6281090B1Method for the manufacture of printed circuit boards with plated resistorsMACDERMID INC·Filed 2000·Granted Aug 28, 2001·69 cites·28 claims
- 0585US4976990AProcess for metallizing non-conductive substratesMACDERMID INC·Filed 1989·Granted Dec 11, 1990·65 cites·14 claims
- 0685US3982045AMethod of manufacture of additive printed circuitboards using permanent resist maskMACDERMID INC·Filed 1974·Granted Sep 21, 1976·30 cites·6 claims
- 0783USRE45881EMethod for enhancing the solderability of a surfaceREDLINE RONALD·Filed 2012·Granted Feb 9, 2016·2 cites·8 claims
- 0883US6905587B2Method for enhancing the solderability of a surfaceFiled 2003·Granted Jun 14, 2005·25 cites·8 claims
- 0983US6444109B1Method for enhancing the solderability of a surfaceFiled 2000·Granted Sep 3, 2002·28 cites·8 claims
- 1082USRE45297EMethod for enhancing the solderability of a surfaceREDLINE RONALD·Filed 2012·Granted Dec 23, 2014·2 cites·7 claims
- 1182US4921571AInhibited composition and method for stripping tin, lead or tin-lead alloy from copper surfacesMACDERMID INC·Filed 1989·Granted May 1, 1990·42 cites·17 claims
- 1282US3959523AAdditive printed circuit boards and method of manufactureMACDERMID INC·Filed 1973·Granted May 25, 1976·30 cites·6 claims
- 1381US4931148AMethod for manufacture of printed circuit boardsMACDERMID INC·Filed 1988·Granted Jun 5, 1990·46 cites·9 claims
- 1481US4608275AOxidizing acceleratorMACDERMID INC·Filed 1985·Granted Aug 26, 1986·43 cites·14 claims
- 1579US4597988AProcess for preparing printed circuit board thru-holesMACDERMID INC·Filed 1985·Granted Jul 1, 1986·40 cites·12 claims
- 1678US6544397B2Method for enhancing the solderability of a surfaceFiled 2001·Granted Apr 8, 2003·15 cites·11 claims
- 1778US6200451B1Method for enhancing the solderability of a surfaceMACDERMID INC·Filed 1999·Granted Mar 13, 2001·39 cites·12 claims
- 1873USRE45842EMethod for enhancing the solderability of a surfaceREDLINE RONALD·Filed 2012·Granted Jan 12, 2016·2 cites·22 claims
- 1970US5037482AComposition and method for improving adhesion of coatings to copper surfacesMACDERMID INC·Filed 1990·Granted Aug 6, 1991·27 cites·11 claims
- 2065US7279108B2Method for the manufacture of printed circuit boards with plated resistorsKUKANSKIS PETER·Filed 2006·Granted Oct 9, 2007·2 cites·14 claims
- 2165US7267259B2Method for enhancing the solderability of a surfaceREDLINE RONALD·Filed 2003·Granted Sep 11, 2007·7 cites·7 claims
- 2264US6474536B1Flux composition and corresponding soldering methodFiled 2000·Granted Nov 5, 2002·10 cites·17 claims
- 2364US5032427AProcess for preparation printed circuit through-holes for metallizationMACDERMID INC·Filed 1989·Granted Jul 16, 1991·25 cites·10 claims
- 2463US5132038AComposition for preparing printed circuit through-holes for metallizationMACDERMID INC·Filed 1990·Granted Jul 21, 1992·25 cites·8 claims
- 2561US5674372AProcess for preparing a non-conductive substrate for electroplatingMACDERMID INC·Filed 1996·Granted Oct 7, 1997·17 cites·16 claims
- 2661US4756930AProcess for preparing printed circuit board thru-holesMACDERMID INC·Filed 1986·Granted Jul 12, 1988·21 cites·7 claims
- 2760US6767445B2Method for the manufacture of printed circuit boards with integral plated resistorsFiled 2002·Granted Jul 27, 2004·5 cites·26 claims
- 2860US5654126APhotodefinable dielectric composition useful in the manufacture of printed circuitsMACDERMID INC·Filed 1996·Granted Aug 5, 1997·15 cites·16 claims
- 2957US6585904B2Method for the manufacture of printed circuit boards with plated resistorsFiled 2001·Granted Jul 1, 2003·5 cites·39 claims
- 3053US5376189AComposition and process for treatment of metallic surfacesMACDERMID INC·Filed 1993·Granted Dec 27, 1994·16 cites·15 claims
- 3153US2008003351A1Method for the manufacture of printed circuit boards with plated resistorsMACDERMID INC·Filed 2007·Application pending·0 cites
- 3251US5077099AElectroless copper plating process and apparatusMACDERMID INC·Filed 1990·Granted Dec 31, 1991·17 cites·12 claims
- 3349US6168836B1Process for plating upon a polymeric surfaceMACDERMID INC·Filed 1998·Granted Jan 2, 2001·13 cites·7 claims
- 3449US4459184AMethod for continuous metal deposition from a non-autocatalytic electroless plating bath using electric potentialMACDERMID INC·Filed 1982·Granted Jul 10, 1984·7 cites·9 claims
- 3547US7034231B2Method for the manufacture of printed circuit boards with plated resistorsKUKANSKIS PETER·Filed 2003·Granted Apr 25, 2006·2 cites·5 claims
- 3647US5620612AMethod for the manufacture of printed circuit boardsMACDERMID INC·Filed 1995·Granted Apr 15, 1997·12 cites·8 claims
- 3746US5213840AMethod for improving adhesion to polymide surfacesMACDERMID INC·Filed 1991·Granted May 25, 1993·13 cites·15 claims
- 3844US4735694AMethod for manufacture of printed circuit boardsMACDERMID INC·Filed 1986·Granted Apr 5, 1988·10 cites·15 claims
- 3943US5869126AProcess for the manufacture of printed circuit boardsMACDERMID INC·Filed 1997·Granted Feb 9, 1999·8 cites·12 claims
- 4043US5648200AProcess for creating circuitry on the surface of a photoimageable dielectricMACDERMID INC·Filed 1996·Granted Jul 15, 1997·9 cites·14 claims
- 4143US5545510APhotodefinable dielectric composition useful in the manufacture of printed circuitsMACDERMID INC·Filed 1995·Granted Aug 13, 1996·6 cites·12 claims
- 4240US4938853AElectrolytic method for the dissolution of copper particles formed during electroless copper depositionMACDERMID INC·Filed 1989·Granted Jul 3, 1990·9 cites·17 claims
- 4339US7022464B2Integral plated resistor and method for the manufacture of printed circuit boards comprising the sameKUKANSKIS PETER·Filed 2004·Granted Apr 4, 2006·0 cites·9 claims
- 4438US2004245210A1Method for the manufacture of printed circuit boards with embedded resistorsFiled 2003·Application pending·0 cites
- 4537US5693364AMethod for the manufacture of printed circuit boardsMACDERMID INC·Filed 1996·Granted Dec 2, 1997·5 cites·9 claims
- 4636US7666471B2Polyimide substrate and method of manufacturing printed wiring board using the sameWOJTASZEK MARK·Filed 2006·Granted Feb 23, 2010·0 cites·4 claims
- 4733US5547559AProcess for plating metals onto various substrates in an adherent fashionMACDERMID INC·Filed 1995·Granted Aug 20, 1996·4 cites·13 claims
- 4832US5763140APhotodefinable dielectric composition useful in the manufacture of printed circuitsMACDERMID INC·Filed 1997·Granted Jun 9, 1998·2 cites·12 claims
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