Inventor · disambiguated record
Byung-Kook Sun
Also filed as: SUN BYUNG K · SUN BYUNG-KOOK
6 granted patents·7 pending applications·304 citations·filing 1998–2005
85Inventor score
Top patents by PatentIndex Score
13 records- 0194US6405431B1Method for manufacturing build-up multi-layer printed circuit board by using yag laserSAMSUNG ELECTRO MECH·Filed 1999·Granted Jun 18, 2002·151 cites·22 claims
- 0291US6119335AMethod for manufacturing multi-layer printed circuit boardSAMSUNG ELECTRO MECH·Filed 1998·Granted Sep 19, 2000·111 cites·36 claims
- 0368US7279412B2Parallel multi-layer printed circuit board having improved interconnection and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2003·Granted Oct 9, 2007·15 cites·11 claims
- 0452US6393696B1Method for manufacturing printed circuit boardSAMSUNG ELECTRO MECH·Filed 1999·Granted May 28, 2002·20 cites·17 claims
- 0551US7169707B2Method of manufacturing package substrate with fine circuit pattern using anodic oxidationSAMSUNG ELECTRO MECH·Filed 2004·Granted Jan 30, 2007·6 cites·33 claims
- 0647US2005284657A1Double-sided printed circuit board without via holes and method of fabricating the sameSUMSUNG ELECTRO MECHANICS CO L·Filed 2005·Application pending·0 cites
- 0743US7284317B2Method of producing printed circuit board with embedded resistorSAMSUNG ELECTRO MECH·Filed 2004·Granted Oct 23, 2007·1 cites·16 claims
- 0843US2006102383A1Method of fabricating high density printed circuit boardSAMSUNG ELECTRO MECH·Filed 2005·Application pending·0 cites
- 0940US2004124003A1Double-sided printed circuit board without via holes and method of fabricating the sameFiled 2003·Application pending·0 cites
- 1038US2006060558A1Method of fabricating package substrate using electroless nickel platingSAMSUNG ELECTRO MECH·Filed 2005·Application pending·0 cites
- 1138US2006172533A1Method of fabricating printed circuit boardSAMSUNG ELECTRO MECH·Filed 2005·Application pending·0 cites
- 1237US2006029726A1Method of fabricating PCB in parallel mannerMOK JEE-SOO·Filed 2004·Application pending·0 cites
- 1337US2004194303A1Method of fabricating multi-layered printed circuit boardSAMSUNG ELECTRO MECH·Filed 2003·Application pending·0 cites
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