Inventor · disambiguated record
Peter Lahnor
Also filed as: LAHNOR PETER
12 granted patents·4 pending applications·71 citations·filing 2000–2021
87Inventor score
Files withINFINEON TECHNOLOGIES AG7QIMONDA AG4SMA SOLAR TECHNOLOGY AG2BAIER ULRICH1INFINEON TECHNOLOGIES AKTIENTG1
Top patents by PatentIndex Score
16 records- 0180US6153492AMethod for improving the readability of alignment marksINFINEON TECHNOLOGIES AG·Filed 2000·Granted Nov 28, 2000·33 cites·22 claims
- 0274US6695687B2Semiconductor substrate holder for chemical-mechanical polishing containing a movable plateINFINEON TECHNOLOGIES AG·Filed 2002·Granted Feb 24, 2004·18 cites·15 claims
- 0368US7894240B2Method and apparatus for reducing charge trapping in high-k dielectric materialQIMONDA AG·Filed 2008·Granted Feb 22, 2011·6 cites·29 claims
- 0456US6689691B2Method of simultaneously polishing a plurality of objects of a similar type, in particular silicon wafers, on a polishing installationINFINEON TECHNOLOGIES AG·Filed 2002·Granted Feb 10, 2004·6 cites·3 claims
- 0553US8138538B2Interconnect structure for semiconductor devicesMOLL HANS-PETER·Filed 2008·Granted Mar 20, 2012·1 cites·25 claims
- 0652US7776759B2Methods for forming an integrated circuit, including openings in a mold layer from nanowires or nanotubesQIMONDA AG·Filed 2007·Granted Aug 17, 2010·4 cites·20 claims
- 0743US2010099253A1Method for Structuring a Layered StackBAIER ULRICH·Filed 2008·Application pending·0 cites
- 0843US2022090826A1Solar module, solar module-integrable assembly and power generation systemSMA SOLAR TECHNOLOGY AG·Filed 2021·Application pending·0 cites
- 0941US2009142916A1Apparatus and method of manufacturing an integrated circuitQIMONDA AG·Filed 2007·Application pending·0 cites
- 1040US10530273B2Unfolding bridge, inverter having reactive-power capability, and polarity reversing methodSMA SOLAR TECHNOLOGY AG·Filed 2018·Granted Jan 7, 2020·0 cites·26 claims
- 1140US2008217672A1Integrated circuit having a memoryQIMONDA AG·Filed 2007·Application pending·0 cites
- 1238US6932674B2Method of determining the endpoint of a planarization processINFINEON TECHNOLOGIES AKTIENTG·Filed 2003·Granted Aug 23, 2005·3 cites·34 claims
- 1336US6821894B2CMP processINFINEON TECHNOLOGIES AG·Filed 2001·Granted Nov 23, 2004·0 cites·7 claims
- 1435US6893968B2Defect-minimizing, topology-independent planarization of process surfaces in semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2002·Granted May 17, 2005·0 cites·19 claims
- 1535US6787431B2Method and semiconductor wafer configuration for producing an alignment mark for semiconductor wafersINFINEON TECHNOLOGIES AG·Filed 2002·Granted Sep 7, 2004·0 cites·8 claims
- 1634US6827635B2Method of planarizing substratesINFINEON TECHNOLOGIES AG·Filed 2003·Granted Dec 7, 2004·0 cites·35 claims
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