Inventor · disambiguated record
John M. Lauffer
Also filed as: LAUFFER JOHN · LAUFFER JOHN M · LAUFFER JOHN MATTHEW · SCHUMACHER RICHARD ANTHONY
129 granted patents·9 pending applications·3,322 citations·filing 1990–2016
99Inventor score
Files withIBM72ENDICOTT INTERCONNECT TECH INC53DAS RABINDRA N6ENDICOTT INTERCONECT TECHNOLOG2LAUFFER JOHN M2
Top patents by PatentIndex Score
138 records- 0198US7800916B2Circuitized substrate with internal stacked semiconductor chips, method of making same, electrical assembly utilizing same and information handling system utilizing sameENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Sep 21, 2010·80 cites·31 claims
- 0298US5027253APrinted circuit boards and cards having buried thin film capacitors and processing techniques for fabricating said boards and cardsIBM·Filed 1990·Granted Jun 25, 1991·206 cites·11 claims
- 0397US7025607B1Capacitor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrateENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Apr 11, 2006·51 cites·18 claims
- 0497US6608757B1Method for making a printed wiring boardIBM·Filed 2002·Granted Aug 19, 2003·120 cites·12 claims
- 0596US6407341B1Conductive substructures of a multilayered laminateIBM·Filed 2000·Granted Jun 18, 2002·138 cites·3 claims
- 0696US6215649B1Printed circuit board capacitor structure and methodIBM·Filed 1998·Granted Apr 10, 2001·110 cites·4 claims
- 0796US6204453B1Two signal one power plane circuit boardIBM·Filed 1998·Granted Mar 20, 2001·173 cites·6 claims
- 0896US5745334ACapacitor formed within printed circuit boardIBM·Filed 1996·Granted Apr 28, 1998·131 cites·22 claims
- 0994US6995322B2High speed circuitized substrate with reduced thru-hole stub, method for fabrication and information handling system utilizing sameENDICOTT INTERCONNECT TECH INC·Filed 2004·Granted Feb 7, 2006·72 cites·29 claims
- 1093US6809269B2Circuitized substrate assembly and method of making sameENDICOTT INTERCONNECT TECH INC·Filed 2002·Granted Oct 26, 2004·36 cites·15 claims
- 1193US5796587APrinted circut board with embedded decoupling capacitance and method for producing sameIBM·Filed 1996·Granted Aug 18, 1998·99 cites·10 claims
- 1292US7841741B2LED lighting assembly and lamp utilizing sameENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Nov 30, 2010·54 cites·20 claims
- 1392US6479093B2Composite laminate circuit structure and methods of interconnecting the sameIBM·Filed 2002·Granted Nov 12, 2002·50 cites·17 claims
- 1492US6370012B1Capacitor laminate for use in printed circuit board and as an interconnectorIBM·Filed 2000·Granted Apr 9, 2002·77 cites·6 claims
- 1591US8607445B1Substrate having internal capacitor and method of making sameDAS RABINDRA N·Filed 2012·Granted Dec 17, 2013·12 cites·19 claims
- 1691US7348677B2Method of providing printed circuit board with conductive holes and board resulting therefromENDICOTT INTERCONNECT TECH INC·Filed 2006·Granted Mar 25, 2008·19 cites·16 claims
- 1791US6828514B2High speed circuit board and method for fabricationENDICOTT INTERCONNECT TECH INC·Filed 2003·Granted Dec 7, 2004·47 cites·17 claims
- 1891US6542379B1Circuitry with integrated passive components and method for producingIBM·Filed 1999·Granted Apr 1, 2003·81 cites·24 claims
- 1990US7442879B2Circuitized substrate with solder-coated microparticle paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same and method of making said substrateENDICOTT INTERCONECT TECHNOLOG·Filed 2005·Granted Oct 28, 2008·23 cites·40 claims
- 2090US7235745B2Resistor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said ciruitized substrate, and information handling system utilizing said ciruitized substrateENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Jun 26, 2007·15 cites·10 claims
- 2189US7293355B2Apparatus and method for making circuitized substrates in a continuous mannerENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Nov 13, 2007·18 cites·12 claims
- 2289US6524352B2Method of making a parallel capacitor laminateIBM·Filed 2002·Granted Feb 25, 2003·56 cites·11 claims
- 2389US6388204B1Composite laminate circuit structure and methods of interconnecting the sameIBM·Filed 2000·Granted May 14, 2002·75 cites·12 claims
- 2488US7791897B2Multi-layer embedded capacitance and resistance substrate coreENDICOTT INTERCONNECT TECH INC·Filed 2008·Granted Sep 7, 2010·15 cites·14 claims
- 2588US7176383B2Printed circuit board with low cross-talk noiseENDICOTT INTERCONNECT TECH INC·Filed 2003·Granted Feb 13, 2007·34 cites·10 claims
- 2687US7429510B2Method of making a capacitive substrate using photoimageable dielectric for use as part of a larger circuitized substrate, method of making said circuitized substrate and method of making an information handling system including said circuitized substrateENDICOTT INTERCONNECT TECH INC·Filed 2006·Granted Sep 30, 2008·15 cites·16 claims
- 2787US6156221ACopper etching compositions, processes and products derived therefromIBM·Filed 1998·Granted Dec 5, 2000·48 cites·20 claims
- 2886US7384856B2Method of making an internal capacitive substrate for use in a circuitized substrate and method of making said circuitized substrateENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Jun 10, 2008·16 cites·19 claims
- 2986US6188305B1Transformer formed in conjunction with printed circuit boardIBM·Filed 1995·Granted Feb 13, 2001·50 cites·3 claims
- 3085US6495772B2High performance dense wire for printed circuit boardIBM·Filed 2001·Granted Dec 17, 2002·35 cites·12 claims
- 3184US7541265B2Capacitor material for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrateENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Jun 2, 2009·12 cites·16 claims
- 3284US7530167B2Method of making a printed circuit board with low cross-talk noiseENDICOTT INTERCONNECT TECH INC·Filed 2006·Granted May 12, 2009·10 cites·10 claims
- 3384US7353590B2Method of forming printed circuit cardIBM·Filed 2005·Granted Apr 8, 2008·10 cites·15 claims
- 3483US6426470B1Formation of multisegmented plated through holesIBM·Filed 2001·Granted Jul 30, 2002·23 cites·15 claims
- 3583US5571593AVia fill compositions for direct attach of devices and methods for applying sameIBM·Filed 1995·Granted Nov 5, 1996·53 cites·7 claims
- 3682US6815085B2Printed circuit board capacitor structure and methodIBM·Filed 2003·Granted Nov 9, 2004·22 cites·11 claims
- 3782US6343001B1Multilayer capacitance structure and circuit board containing the sameIBM·Filed 2000·Granted Jan 29, 2002·24 cites·15 claims
- 3881US7449381B2Method of making a capacitive substrate for use as part of a larger circuitized substrate, method of making said circuitized substrate and method of making an information handling system including said circuitized substrateENDICOTT INTERCONECT TECHNOLOG·Filed 2006·Granted Nov 11, 2008·10 cites·19 claims
- 3981US7211289B2Method of making multilayered printed circuit board with filled conductive holesENDICOTT INTERCONNECT TECH INC·Filed 2003·Granted May 1, 2007·21 cites·10 claims
- 4081US6204456B1Filling open through holes in a multilayer boardIBM·Filed 1998·Granted Mar 20, 2001·48 cites·32 claims
- 4180US7977034B1Method for making circuitized substrates having photo-imageable dielectric layers in a continuous mannerENDICOTT INTERCONNECT TECH INC·Filed 2010·Granted Jul 12, 2011·4 cites·11 claims
- 4280US6964884B1Circuitized substrates utilizing three smooth-sided conductive layers as part thereof, method of making same, and electrical assemblies and information handling systems utilizing sameENDICOTT INTERCONNECT TECH INC·Filed 2004·Granted Nov 15, 2005·20 cites·12 claims
- 4379US6739027B1Method for producing printed circuit board with embedded decoupling capacitanceIBM·Filed 2000·Granted May 25, 2004·23 cites·7 claims
- 4479US6201194B1Multi-voltage plane, multi-signal plane circuit card with photoimageable dielectricIBM·Filed 1998·Granted Mar 13, 2001·43 cites·13 claims
- 4578US7627947B2Method for making a multilayered circuitized substrateENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Dec 8, 2009·7 cites·13 claims
- 4678US7326643B2Method of making circuitized substrate with internal organic memory deviceENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Feb 5, 2008·6 cites·8 claims
- 4778US6700078B2Formation of multisegmented plated through holesIBM·Filed 2002·Granted Mar 2, 2004·17 cites·11 claims
- 4877US7629559B2Method of improving electrical connections in circuitized substratesENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Dec 8, 2009·7 cites·16 claims
- 4977US6830627B1Copper cleaning compositions, processes and products derived therefromIBM·Filed 1999·Granted Dec 14, 2004·34 cites·20 claims
- 5077US6521844B1Through hole in a photoimageable dielectric structure with wired and uncured dielectricIBM·Filed 1999·Granted Feb 18, 2003·33 cites·11 claims
Showing the top 50 of 138 patent records by PatentIndex Score.
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