Inventor · disambiguated record
Kenneth C. Marston
Also filed as: MARSTON KENNETH · MARSTON KENNETH C · MARSTON KENNETH CHARLES
27 granted patents·2 pending applications·300 citations·filing 2001–2023
96Inventor score
Top patents by PatentIndex Score
29 records- 0198US7808781B2Apparatus and methods for high-performance liquid cooling of multiple chips with disparate cooling requirementsIBM·Filed 2008·Granted Oct 5, 2010·47 cites·14 claims
- 0297US7928562B2Segmentation of a die stack for 3D packaging thermal managementIBM·Filed 2008·Granted Apr 19, 2011·58 cites·18 claims
- 0394US10757833B2Cooling structure for electronic boardsIBM·Filed 2019·Granted Aug 25, 2020·7 cites·17 claims
- 0494US9401315B1Thermal hot spot cooling for semiconductor devicesGLOBALFOUNDRIES INC·Filed 2015·Granted Jul 26, 2016·16 cites·20 claims
- 0593US8115303B2Semiconductor package structures having liquid coolers integrated with first level chip package modulesBEZAMA RASCHID JOSE·Filed 2008·Granted Feb 14, 2012·28 cites·11 claims
- 0692US8421217B2Achieving mechanical and thermal stability in a multi-chip packageCASEY JON A·Filed 2012·Granted Apr 16, 2013·19 cites·19 claims
- 0792US8202765B2Achieving mechanical and thermal stability in a multi-chip packageCASEY JON A·Filed 2009·Granted Jun 19, 2012·28 cites·22 claims
- 0891US10172258B2Cooling structure for electronic boardsIBM·Filed 2017·Granted Jan 1, 2019·5 cites·10 claims
- 0991US8772927B2Semiconductor package structures having liquid cooler integrated with first level chip package modulesBEZAMA RASCHID JOSE·Filed 2011·Granted Jul 8, 2014·12 cites·10 claims
- 1091US7834442B2Electronic package method and structure with cure-melt hierarchyIBM·Filed 2007·Granted Nov 16, 2010·24 cites·20 claims
- 1187US9883612B2Heat sink attachment on existing heat sinksIBM·Filed 2015·Granted Jan 30, 2018·5 cites·17 claims
- 1287US9721870B2Cooling structure for electronic boardsIBM·Filed 2014·Granted Aug 1, 2017·5 cites·16 claims
- 1386US11152282B1Localized catalyst for enhanced thermal interface material heat transferIBM·Filed 2020·Granted Oct 19, 2021·2 cites·20 claims
- 1479US10342160B2Heat sink attachment on existing heat sinksIBM·Filed 2017·Granted Jul 2, 2019·2 cites·20 claims
- 1579US8363404B2Implementing loading and heat removal for hub module assemblyIBM·Filed 2010·Granted Jan 29, 2013·5 cites·20 claims
- 1676US7917328B2Tracking thermal mini-cycle stressIBM·Filed 2008·Granted Mar 29, 2011·8 cites·20 claims
- 1774US9272498B2Precast thermal interface adhesive for easy and repeated, separation and rematingCOLGAN EVAN GEORGE·Filed 2012·Granted Mar 1, 2016·2 cites·13 claims
- 1868US8214658B2Enhanced thermal management for improved module reliabilityCASEY JON A·Filed 2008·Granted Jul 3, 2012·4 cites·22 claims
- 1965US10905029B2Cooling structure for electronic boardsIBM·Filed 2019·Granted Jan 26, 2021·0 cites·12 claims
- 2062US6964885B2Stress resistant land grid array (LGA) module and method of forming the sameIBM·Filed 2004·Granted Nov 15, 2005·9 cites·33 claims
- 2161US10542636B2Cooling structure for electronic boardsIBM·Filed 2018·Granted Jan 21, 2020·0 cites·8 claims
- 2258US6703560B2Stress resistant land grid array (LGA) module and method of forming the sameIBM·Filed 2001·Granted Mar 9, 2004·7 cites·7 claims
- 2357US2024347497A1Thermal solutions for advanced semiconductorsIBM·Filed 2023·Application pending·0 cites
- 2456US7239516B2Flexure plate for maintaining contact between a cooling plate/heat sink and a microchipIBM·Filed 2004·Granted Jul 3, 2007·7 cites·21 claims
- 2554US11430710B2Lid/heat spreader having targeted flexibilityIBM·Filed 2020·Granted Aug 30, 2022·0 cites·20 claims
- 2647US8268389B2Precast thermal interface adhesive for easy and repeated, separation and rematingCOLGAN EVAN G·Filed 2010·Granted Sep 18, 2012·0 cites·11 claims
- 2745US11410905B2Optimized weight heat spreader for an electronic packageIBM·Filed 2019·Granted Aug 9, 2022·0 cites·15 claims
- 2841US11164804B2Integrated circuit (IC) device package lid attach utilizing nano particle metallic pasteIBM·Filed 2019·Granted Nov 2, 2021·0 cites·6 claims
- 2941US2008002363A1Direct liquid jet impingement module for high heat flux electronics packagesIBM·Filed 2006·Application pending·0 cites
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