Inventor
CHEN WILLIAM TZE-YOU
US9 patents
⚠️ This page may combine multiple inventors who share the name “CHEN WILLIAM TZE-YOU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED SEMICONDUCTOR ENG
4 patentsUS7199438B2Apr 3, 2007
Overmolded optical package
ADVANCED SEMICONDUCTOR ENG61 citations97
US6864168B2Mar 8, 2005
Bump and fabricating process thereof
ADVANCED SEMICONDUCTOR ENG25 citations92
US6819002B2Nov 16, 2004
Under-ball-metallurgy layer
ADVANCED SEMICONDUCTOR ENG28 citations92
US6891274B2May 10, 2005
Under-bump-metallurgy layer for improving adhesion
ADVANCED SEMICONDUCTOR ENG6 citations73
IBM
4 patentsUS6429530B1Aug 6, 2002
Miniaturized chip scale ball grid array semiconductor package
IBM50 citations91
US6403882B1Jun 11, 2002
Protective cover plate for flip chip assembly backside
IBM34 citations91
US6013355AJan 11, 2000
Testing laminates with x-ray moire interferometry
IBM52 citations91
US5709336AJan 20, 1998
Method of forming a solderless electrical connection with a wirebond chip
IBM13 citations72