Inventor · disambiguated record
Jennifer I. Bennett
Also filed as: BENNETT JENNIFER · BENNETT JENNIFER I
25 granted patents·4 pending applications·34 citations·filing 2017–2023
92Inventor score
Files withIBM29
Top patents by PatentIndex Score
29 records- 0196US10575448B1Electromagnetic shielding of heat sinks with shape-memory alloy groundingIBM·Filed 2018·Granted Feb 25, 2020·20 cites·20 claims
- 0294US11699884B2Electromagnetic shielding of heatsinks with spring press-fit pinsIBM·Filed 2020·Granted Jul 11, 2023·4 cites·4 claims
- 0386US10575393B1Heat-shielding microcapsules for protecting temperature sensitive componentsIBM·Filed 2018·Granted Feb 25, 2020·4 cites·18 claims
- 0483US11558964B2Process for in-situ warpage monitoring during solder reflow for head-in-pillow defect escape preventionIBM·Filed 2020·Granted Jan 17, 2023·2 cites·9 claims
- 0576US10262907B1Dye and pry process for removing quad flat no-lead packages and bottom termination componentsIBM·Filed 2017·Granted Apr 16, 2019·2 cites·13 claims
- 0667US10677856B2Facilitating reliable circuit board press-fit connector assembly fabricationIBM·Filed 2018·Granted Jun 9, 2020·2 cites·20 claims
- 0763US10678316B2Reducing thermal cycling fatigueIBM·Filed 2019·Granted Jun 9, 2020·0 cites·1 claims
- 0861US12253354B2Radio frequency identification based three-dimensional metrologyIBM·Filed 2021·Granted Mar 18, 2025·0 cites·20 claims
- 0961US10667433B2Implementing contained thermal interface material for pluggable applicationsIBM·Filed 2018·Granted May 26, 2020·0 cites·15 claims
- 1060US11906574B2Hybrid socket warp indicatorIBM·Filed 2021·Granted Feb 20, 2024·0 cites·7 claims
- 1159US12389547B2Hybrid mechanical drillIBM·Filed 2021·Granted Aug 12, 2025·0 cites·15 claims
- 1259US2025166401A1Hardware integrity validationIBM·Filed 2023·Application pending·0 cites
- 1358US10593601B2Dye and pry process for removing quad flat no-lead packages and bottom termination componentsIBM·Filed 2019·Granted Mar 17, 2020·0 cites·11 claims
- 1457US10957623B2Thermal interface material structures including protruding surface features to reduce thermal interface material migrationIBM·Filed 2019·Granted Mar 23, 2021·0 cites·5 claims
- 1556US11617519B2Needle electrode for position-dependent injectionIBM·Filed 2019·Granted Apr 4, 2023·0 cites·12 claims
- 1656US11445650B2Localized rework using liquid media solderingIBM·Filed 2019·Granted Sep 13, 2022·0 cites·20 claims
- 1756US2024306347A1Heatsink with phase changing plugs and extinguishing coolantIBM·Filed 2023·Application pending·0 cites
- 1855US12100910B2Shape-memory alloy lock for connectorsIBM·Filed 2021·Granted Sep 24, 2024·0 cites·13 claims
- 1954US11517072B2Adaptive electrostatic discharge and electric hazard footwearIBM·Filed 2019·Granted Dec 6, 2022·0 cites·20 claims
- 2054US10372182B2Reducing thermal cycling fatigueIBM·Filed 2017·Granted Aug 6, 2019·0 cites·8 claims
- 2152US12189763B2Securing digital data by automatic mechanism incapacitating data storage deviceIBM·Filed 2022·Granted Jan 7, 2025·0 cites·20 claims
- 2251US10834839B1Barrier for hybrid socket movement reductionIBM·Filed 2019·Granted Nov 10, 2020·0 cites·20 claims
- 2351US2024232410A1Sensitive data protectionIBM·Filed 2023·Application pending·0 cites
- 2450US11245238B2Tool for shaping contact tab interconnects at a circuit card edgeIBM·Filed 2018·Granted Feb 8, 2022·0 cites·10 claims
- 2549US11175100B2Heat sinks using memory shaping materialsIBM·Filed 2019·Granted Nov 16, 2021·0 cites·10 claims
- 2648US11211760B2Stutter step press-fit connector insertion processIBM·Filed 2019·Granted Dec 28, 2021·0 cites·7 claims
- 2748US10881007B2Recondition process for BGA using fluxIBM·Filed 2017·Granted Dec 29, 2020·0 cites·15 claims
- 2847US2019118312A1Solder flux containing fluorescent microcapsules and method to visualize unactivated solder fluxIBM·Filed 2017·Application pending·0 cites
- 2945US11268809B2Detecting and correcting deficiencies in surface conditions for bonding applicationsIBM·Filed 2018·Granted Mar 8, 2022·0 cites·18 claims
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