Inventor · disambiguated record
Qinglin Song
Also filed as: SONG QINGLIN
16 granted patents·3 pending applications·22 citations·filing 2007–2021
87Inventor score
Files withGOERTEK INC8WEIFANG GOERTEK MICROELECTRONICS CO LTD7COVESTRO INTELLECTUAL PROPERTY GMBH & CO KG1GOERTEK OPTICAL TECH CO LTD1SONG QINGLIN1
Top patents by PatentIndex Score
19 records- 0180US12060503B2Adhesive and application thereofCOVESTRO INTELLECTUAL PROPERTY GMBH & CO KG·Filed 2019·Granted Aug 13, 2024·1 cites·14 claims
- 0276US8121315B2Condenser microphone chipSONG QINGLIN·Filed 2007·Granted Feb 21, 2012·15 cites·28 claims
- 0368US10349187B2Acoustic sensor integrated MEMS microphone structure and fabrication method thereofGOERTEK INC·Filed 2015·Granted Jul 9, 2019·2 cites·10 claims
- 0466US9108840B2MEMS microphone and method for packaging the sameWANG ZHE·Filed 2010·Granted Aug 18, 2015·4 cites·15 claims
- 0556US11417463B2Method for manufacturing coil, coil and electronic deviceGOERTEK INC·Filed 2017·Granted Aug 16, 2022·0 cites·8 claims
- 0653US12164113B2Optical engine and AR deviceGOERTEK OPTICAL TECH CO LTD·Filed 2021·Granted Dec 10, 2024·0 cites·9 claims
- 0750US12074037B2Packaging method for circuit units comprising circuit baseplateWEIFANG GOERTEK MICROELECTRONICS CO LTD·Filed 2019·Granted Aug 27, 2024·0 cites·10 claims
- 0847US10246323B2Cavity forming method for a sensor chip, manufacturing method thereof, chip and electronics apparatusGOERTEK INC·Filed 2015·Granted Apr 2, 2019·0 cites·9 claims
- 0946US12031920B2Method for detecting coverage rate of intermetallic compoundWEIFANG GOERTEK MICROELECTRONICS CO LTD·Filed 2019·Granted Jul 9, 2024·0 cites·10 claims
- 1045US11516595B2Integrated structure of mems microphone and air pressure sensor and fabrication method thereofWEIFANG GOERTEK MICROELECTRONICS CO LTD·Filed 2018·Granted Nov 29, 2022·0 cites·10 claims
- 1144US11882681B2Electromagnetic shielding structure and manufacturing method thereof, and electronic deviceWEIFANG GOERTEK MICROELECTRONICS CO LTD·Filed 2019·Granted Jan 23, 2024·0 cites·8 claims
- 1242US2022408549A1Packaging structure for circuit unitsWEIFANG GOERTEK MICROELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 1340US11099467B2Micro laser diode projector and electronics apparatusGOERTEK INC·Filed 2017·Granted Aug 24, 2021·0 cites·8 claims
- 1440US10277968B2Microphone with dustproof through holesGOERTEK INC·Filed 2015·Granted Apr 30, 2019·0 cites·6 claims
- 1540US2020365320A1Method for manufacturing coil, coil and electronic deviceGOERTEK INC·Filed 2017·Application pending·0 cites
- 1638US12107053B2Shielding process for SIP packagingWEIFANG GOERTEK MICROELECTRONICS CO LTD·Filed 2019·Granted Oct 1, 2024·0 cites·10 claims
- 1737US12002685B2Method for packaging chipWEIFANG GOERTEK MICROELECTRONICS CO LTD·Filed 2019·Granted Jun 4, 2024·0 cites·9 claims
- 1833US2017363656A1Z-axis structure in accelerometerGOERTEK INC·Filed 2015·Application pending·0 cites
- 1932US10177055B2Packaging structure of integrated sensorGOERTEK INC·Filed 2015·Granted Jan 8, 2019·0 cites·15 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →