Inventor · disambiguated record
Dewen Tian
Also filed as: TIAN DEWEN
7 granted patents·1 pending application·0 citations·filing 2012–2019
67Inventor score
Top patents by PatentIndex Score
8 records- 0150US12074037B2Packaging method for circuit units comprising circuit baseplateWEIFANG GOERTEK MICROELECTRONICS CO LTD·Filed 2019·Granted Aug 27, 2024·0 cites·10 claims
- 0246US12031920B2Method for detecting coverage rate of intermetallic compoundWEIFANG GOERTEK MICROELECTRONICS CO LTD·Filed 2019·Granted Jul 9, 2024·0 cites·10 claims
- 0344US11882681B2Electromagnetic shielding structure and manufacturing method thereof, and electronic deviceWEIFANG GOERTEK MICROELECTRONICS CO LTD·Filed 2019·Granted Jan 23, 2024·0 cites·8 claims
- 0442US2022408549A1Packaging structure for circuit unitsWEIFANG GOERTEK MICROELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 0538US12107053B2Shielding process for SIP packagingWEIFANG GOERTEK MICROELECTRONICS CO LTD·Filed 2019·Granted Oct 1, 2024·0 cites·10 claims
- 0637US12002685B2Method for packaging chipWEIFANG GOERTEK MICROELECTRONICS CO LTD·Filed 2019·Granted Jun 4, 2024·0 cites·9 claims
- 0736US10014272B2Die bonding with liquid phase solderASM TECH SINGAPORE PTE LTD·Filed 2015·Granted Jul 3, 2018·0 cites·17 claims
- 0833US8657180B2Bond pad assessment for wire bondingLI MING·Filed 2012·Granted Feb 25, 2014·0 cites·6 claims
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