Inventor · disambiguated record
Mohammad Waseem Hussain
Also filed as: HUSSAIN MOHAMMAD WASEEM
6 granted patents·1 pending application·3 citations·filing 2018–2024
70Inventor score
Files withTEXAS INSTRUMENTS INC7
Top patents by PatentIndex Score
7 records- 0190US12142550B2Multi-chip module leadless packageTEXAS INSTRUMENTS INC·Filed 2022·Granted Nov 12, 2024·1 cites·19 claims
- 0289US11538741B2Multi-chip module leadless packageTEXAS INSTRUMENTS INC·Filed 2021·Granted Dec 27, 2022·2 cites·20 claims
- 0377US2025022781A1Multi-chip module leadless packageTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0459US11410913B2Multi-layer die attachmentTEXAS INSTRUMENTS INC·Filed 2020·Granted Aug 9, 2022·0 cites·8 claims
- 0555US10636727B2Multi-layer die attachmentTEXAS INSTRUMENTS INC·Filed 2018·Granted Apr 28, 2020·0 cites·16 claims
- 0651US11569154B2Interdigitated outward and inward bent leads for packaged electronic deviceTEXAS INSTRUMENTS INC·Filed 2021·Granted Jan 31, 2023·0 cites·20 claims
- 0747US11855001B2Leadless leadframe and semiconductor device package therefromTEXAS INSTRUMENTS INC·Filed 2020·Granted Dec 26, 2023·0 cites·38 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →