Inventor · disambiguated record
Jong Bo Shim
Also filed as: SHIM JONG BO
26 granted patents·13 pending applications·341 citations·filing 2002–2024
96Inventor score
Top patents by PatentIndex Score
39 records- 0197US9997446B2Semiconductor package including a rewiring layer with an embedded chipSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jun 12, 2018·24 cites·19 claims
- 0297US6847109B2Area array semiconductor package and 3-dimensional stack thereofSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jan 25, 2005·153 cites·31 claims
- 0396US10026724B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jul 17, 2018·23 cites·20 claims
- 0494US10224272B2Semiconductor package including a rewiring layer with an embedded chipSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Mar 5, 2019·10 cites·20 claims
- 0594US10199319B2Printed circuit board and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Feb 5, 2019·11 cites·12 claims
- 0694US8829686B2Package-on-package assembly including adhesive containment elementSAMSUNG ELECTRONICS CO LTD·Filed 2012·Granted Sep 9, 2014·24 cites·19 claims
- 0793US12057366B2Semiconductor devices including a lower semiconductor package, an upper semiconductor package on the lower semiconductor package, and a connection pattern between the lower semiconductor package and the upper semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Aug 6, 2024·1 cites·20 claims
- 0893US11637140B2Image sensor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 25, 2023·2 cites·20 claims
- 0993US11600545B2Semiconductor devices including a lower semiconductor package, an upper semiconductor package on the lower semiconductor package, and a connection pattern between the lower semiconductor package and the upper semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 7, 2023·2 cites·19 claims
- 1091US9230876B2Stack type semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jan 5, 2016·13 cites·9 claims
- 1187US10971535B2Image sensor packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Apr 6, 2021·4 cites·19 claims
- 1286US11069592B2Semiconductor packages including a lower structure, an upper structure on the lower structure, and a connection pattern between the lower structure and the upper structureSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jul 20, 2021·3 cites·20 claims
- 1386US10680025B2Semiconductor package and image sensorSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jun 9, 2020·4 cites·19 claims
- 1485US9899337B2Semiconductor package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Feb 20, 2018·5 cites·12 claims
- 1581US2024363472A1Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1679US10964618B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 30, 2021·3 cites·20 claims
- 1778US10750112B2Substrate structures for image sensor modules and image sensor modules including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 18, 2020·2 cites·18 claims
- 1878US8922008B2Bump structure, having concave lateral sides, semiconductor package having the bump structure, and method of forming the bump structureSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Dec 30, 2014·5 cites·14 claims
- 1977US12113087B2Image sensor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 8, 2024·0 cites·20 claims
- 2073US7211889B2Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted May 1, 2007·20 cites·9 claims
- 2173US7161249B2Multi-chip package (MCP) with spacerSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Jan 9, 2007·27 cites·31 claims
- 2269US9966364B2Semiconductor package and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted May 8, 2018·2 cites·19 claims
- 2366US7304371B2Lead frame having a lead with a non-uniform widthSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Dec 4, 2007·3 cites·14 claims
- 2465US12300665B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 13, 2025·0 cites·21 claims
- 2559US2024105567A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2657US2024055398A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2756US12283578B2Semiconductor package and method of fabricating sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 22, 2025·0 cites·18 claims
- 2856US2024128173A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2955US11227855B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jan 18, 2022·0 cites·14 claims
- 3054US11908806B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 20, 2024·0 cites·19 claims
- 3154US2023076184A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 3252US2009265928A1Circuit board and manufacturing method thereofSHIM JONG-BO·Filed 2009·Application pending·0 cites
- 3347US2007034401A1Circuit board and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 3445US2008160725A1Semiconductor die pick up apparatus and method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 3545US2008160724A1Method of dicingSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 3641US2008111224A1Multi stack package and method of fabricating the sameBYUN HAK-KYOON·Filed 2007·Application pending·0 cites
- 3740US2013161836A1Semiconductor package having interposer comprising a plurality of segmentsYEOM KUN-DAE·Filed 2012·Application pending·0 cites
- 3837US2017047310A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
- 3936US2017047309A1Fabricating method of semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →