Inventor · disambiguated record
Cheng-Hsien Kuo
Also filed as: KUO CHENG-HSIEN
8 granted patents·2 pending applications·69 citations·filing 2004–2011
86Inventor score
Top patents by PatentIndex Score
10 records- 0182US8411443B2Slidingly-engaged heat-dissipating assembly for memory and memory device having the sameCHEN WEI-HAU·Filed 2011·Granted Apr 2, 2013·12 cites·10 claims
- 0281US8531845B2Structure of anti tamper case for solid state diskCHEN WEI-HAU·Filed 2011·Granted Sep 10, 2013·9 cites·6 claims
- 0360US7230279B2Memory cardADVANCED FLASH MEMORY CARD TEC·Filed 2004·Granted Jun 12, 2007·2 cites·10 claims
- 0459US7205644B2Memory card structure and manufacturing method thereofADVANCED FLASH MEMORY CARD TEC·Filed 2004·Granted Apr 17, 2007·11 cites·16 claims
- 0559US7193304B2Memory card structureADVANCED FLASH MEMORY CARD TEC·Filed 2004·Granted Mar 20, 2007·11 cites·7 claims
- 0654USD626521SHeat-dissipating device for memoryCOMPTAKE TECHNOLOGY INC·Filed 2010·Granted Nov 2, 2010·10 cites·1 claims
- 0751US2008143008A1Molding apparatus and molding processKUO CHENG-HSIEN·Filed 2006·Application pending·0 cites
- 0849USD626520SHeat-dissipating device for memoryCOMPTAKE TECHNOLOGY INC·Filed 2010·Granted Nov 2, 2010·8 cites·1 claims
- 0945USD659110SHeat-dissipating device for memoryCHEN WEI-HAU·Filed 2010·Granted May 8, 2012·6 cites·1 claims
- 1044US2005017392A1Molding apparatus and molding processFiled 2004·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →