Inventor · disambiguated record
Shigeru Asami
Also filed as: ASAMI SHIGERU
12 granted patents·2 pending applications·254 citations·filing 1985–2011
92Inventor score
Top patents by PatentIndex Score
14 records- 0190US7236070B2Electronic component module and manufacturing method thereofTDK CORP·Filed 2004·Granted Jun 26, 2007·33 cites·10 claims
- 0288US4752820AOptical recording medium having a liquid crystal layerTDK CORP·Filed 1985·Granted Jun 21, 1988·36 cites·13 claims
- 0388US4713314AOptical recording mediumTDK CORP·Filed 1985·Granted Dec 15, 1987·35 cites·44 claims
- 0487US4735889AOptical recording mediumTDK CORP·Filed 1985·Granted Apr 5, 1988·35 cites·30 claims
- 0583US7820274B2Prepreg and conductive layer-laminated substrate for printed wiring boardNOF CORP·Filed 2007·Granted Oct 26, 2010·8 cites·7 claims
- 0682US6917526B2Electronic component moduleTDK CORP·Filed 2004·Granted Jul 12, 2005·30 cites·6 claims
- 0776US7102896B2Electronic component moduleTDK CORP·Filed 2004·Granted Sep 5, 2006·21 cites·7 claims
- 0866US8929089B2Electronic circuit module component and method of manufacturing electronic circuit module componentASAMI SHIGERU·Filed 2011·Granted Jan 6, 2015·4 cites·4 claims
- 0965US6500535B1Heat resistant, low dielectric polymers, and films, substrates, electronic parts and heat resistant resin molded parts using the sameTDK CORP·Filed 1998·Granted Dec 31, 2002·27 cites·21 claims
- 1058US4739345AOptical recording diskTDK CORP·Filed 1986·Granted Apr 19, 1988·18 cites·36 claims
- 1151US6914787B2Electronic component moduleTDK CORP·Filed 2004·Granted Jul 5, 2005·5 cites·4 claims
- 1250US6713581B2Crosslinkable polymer material of low relative permittivity, and films, substrates and electronic units formed of itTDK CORP·Filed 2002·Granted Mar 30, 2004·2 cites·7 claims
- 1345US2009002967A1Electronic module and fabrication method thereofTDK CORP·Filed 2008·Application pending·0 cites
- 1436US2011198115A1Electronic component built-in module and method of manufacturing the sameTDK CORP·Filed 2011·Application pending·0 cites
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