Inventor · disambiguated record
Hirokazu Sampei
Also filed as: SAMPEI HIROKAZU
5 granted patents·19 citations·filing 2002–2023
70Inventor score
Top patents by PatentIndex Score
5 records- 0170US6903637B2Connecting member, a micro-switch, a method for manufacturing a connecting member, and a method for manufacturing a micro-switchADVANTEST CORP·Filed 2002·Granted Jun 7, 2005·15 cites·21 claims
- 0263US7800386B2Contact device and method for producing the sameADVANTEST CORP·Filed 2008·Granted Sep 21, 2010·4 cites·15 claims
- 0359US12278170B2Semiconductor module, electrical component, and connection structure of the semiconductor module and the electrical componentDENSO CORP·Filed 2022·Granted Apr 15, 2025·0 cites·12 claims
- 0447US12438071B2Semiconductor module and method for manufacturing semiconductor moduleDENSO CORP·Filed 2023·Granted Oct 7, 2025·0 cites·6 claims
- 0547US11488895B2Semiconductor device and maunfacturing method of semiconductor deviceDENSO CORP·Filed 2021·Granted Nov 1, 2022·0 cites·11 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →