Inventor · disambiguated record
Hsueh-Te Wang
Also filed as: WANG HSUEH-TE
11 granted patents·4 pending applications·444 citations·filing 1999–2018
91Inventor score
Top patents by PatentIndex Score
15 records- 0196US6258626B1Method of making stacked chip packageADVANCED SEMICONDUCTOR ENG·Filed 2000·Granted Jul 10, 2001·152 cites·16 claims
- 0294US6768190B2Stack type flip-chip packageADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Jul 27, 2004·141 cites·3 claims
- 0390US7034388B2Stack type flip-chip packageADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Apr 25, 2006·73 cites·20 claims
- 0476US7253508B2Semiconductor package with a flip chip on a solder-resist leadframeADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Aug 7, 2007·24 cites·14 claims
- 0573US10037936B2Semiconductor package with coated bonding wires and fabrication method thereofMEDIATEK INC·Filed 2016·Granted Jul 31, 2018·2 cites·9 claims
- 0671US7164202B2Quad flat flip chip package and leadframe thereofADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Jan 16, 2007·17 cites·13 claims
- 0764US7067904B2Flip-chip type quad flat package and leadframeADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Jun 27, 2006·11 cites·12 claims
- 0857US6153939AFlip-chip semiconductor device with enhanced reliability and manufacturing efficiency, and the method for under filling the sameADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted Nov 28, 2000·22 cites·6 claims
- 0947US10685943B2Semiconductor chip package with resilient conductive paste post and fabrication method thereofMEDIATEK INC·Filed 2017·Granted Jun 16, 2020·0 cites·14 claims
- 1046US7022551B2Quad flat flip chip packaging process and leadframe thereforADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Apr 4, 2006·2 cites·12 claims
- 1145US10978406B2Semiconductor package including EMI shielding structure and method for forming the sameMEDIATEK INC·Filed 2018·Granted Apr 13, 2021·0 cites·13 claims
- 1236US2005248037A1Flip-chip package substrate with a high-density layoutADVANCED SEMICONDUCTOR ENG·Filed 2005·Application pending·0 cites
- 1335US2012119342A1Advanced quad flat non-leaded package structure and manufacturing method thereofCHANG CHIEN PAO-HUEI·Filed 2010·Application pending·0 cites
- 1432US2004124541A1Flip chip packageFiled 2003·Application pending·0 cites
- 1532US2003071347A1Semiconductor chip packaging device and method of manufacturing the sameFiled 2002·Application pending·0 cites
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