Inventor · disambiguated record
Susumu Okikawa
Also filed as: OKIKAWA SUSUMU
15 granted patents·547 citations·filing 1976–2000
95Inventor score
Technology areasH10W
Top patents by PatentIndex Score
15 records- 0184US4845543ASemiconductor device and method of manufacturing the sameHITACHI LTD·Filed 1987·Granted Jul 4, 1989·72 cites·26 claims
- 0283US4998002AWire-bonding method, wire-bonding apparatus, and semiconductor device produced by the wire-bonding methodHITACHI LTD·Filed 1988·Granted Mar 5, 1991·62 cites·34 claims
- 0379US5031821ASemiconductor integrated circuit device, method for producing or assembling same, and producing or assembling apparatus for use in the methodHITACHI LTD·Filed 1989·Granted Jul 16, 1991·56 cites·19 claims
- 0477US6419149B1Method for producing wiring layer transfer compositeHITACHI METALS LTD·Filed 2000·Granted Jul 16, 2002·27 cites·17 claims
- 0577US4100566AResin-sealed type semiconductor devices and manufacturing method of the sameHITACHI LTD·Filed 1977·Granted Jul 11, 1978·36 cites·16 claims
- 0674US5844310AHeat spreader semiconductor device with heat spreader and method for producing sameHITACHI METALS LTD·Filed 1996·Granted Dec 1, 1998·45 cites·18 claims
- 0771US6032362AMethod for producing a heat spreader and semiconductor device with a heat spreaderHITACHI METALS LTD·Filed 1998·Granted Mar 7, 2000·38 cites·5 claims
- 0869US4976393ASemiconductor device and production process thereof, as well as wire bonding device used thereforHITACHI LTD·Filed 1987·Granted Dec 11, 1990·40 cites·33 claims
- 0967US5285949AWire-bonding method, wire-bonding apparatus, and semiconductor device produced by the wire-bonding methodHITACHI LTD·Filed 1992·Granted Feb 15, 1994·36 cites·32 claims
- 1066US4950866AMethod and apparatus of bonding insulated and coated wireHITACHI LTD·Filed 1988·Granted Aug 21, 1990·38 cites·4 claims
- 1162US4564734AWire bonderHITACHI LTD·Filed 1983·Granted Jan 14, 1986·24 cites·31 claims
- 1256US5152450AWire-bonding method, wire-bonding apparatus,and semiconductor device produced by the wire-bonding methodHITACHI LTD·Filed 1990·Granted Oct 6, 1992·24 cites·24 claims
- 1355US4791472ALead frame and semiconductor device using the sameHITACHI LTD·Filed 1988·Granted Dec 13, 1988·26 cites·2 claims
- 1448US4123293AMethod of providing semiconductor pellet with heat sinkHITACHI LTD·Filed 1976·Granted Oct 31, 1978·14 cites·13 claims
- 1544US4326215AEncapsulated semiconductor device with a metallic base plateHITACHI LTD·Filed 1979·Granted Apr 20, 1982·9 cites·7 claims
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