Inventor · disambiguated record
Min-Il Kim
Also filed as: KIM MIN-IL
4 granted patents·42 citations·filing 2003–2007
76Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD4
Top patents by PatentIndex Score
4 records- 0189US7227086B2Semiconductor chip package having an adhesive tape attached on bonding wiresSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jun 5, 2007·21 cites·14 claims
- 0270US7410832B2Semiconductor chip package having an adhesive tape attached on bonding wiresSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Aug 12, 2008·4 cites·9 claims
- 0364US7005577B2Semiconductor chip package having an adhesive tape attached on bonding wiresSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Feb 28, 2006·11 cites·9 claims
- 0452US7096914B2Apparatus for bonding a chip using an insulating adhesive tapeSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Aug 29, 2006·6 cites·19 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →