Inventor · disambiguated record
Takashi Suzumura
Also filed as: SUZUMURA TAKASHI
9 granted patents·5 pending applications·108 citations·filing 1981–2008
88Inventor score
Files withHITACHI CABLE3HITACHI LTD3TOYOTA MOTOR CO LTD3JAPAN ATOMIC ENERGY RES INST1KIKUKAWA DAISUKE1
Top patents by PatentIndex Score
14 records- 0176US6579623B2Composite material member for semiconductor device and insulated and non-insulated semiconductor devices using composite material memberHITACHI LTD·Filed 2002·Granted Jun 17, 2003·20 cites·16 claims
- 0272US7100416B2Carrier and method of manufacturing carrierMEG INC·Filed 2003·Granted Sep 5, 2006·14 cites·41 claims
- 0362US5635009AMethod for sticking an insulating film to a lead frameHITACHI CABLE·Filed 1994·Granted Jun 3, 1997·28 cites·2 claims
- 0458US5927119ABulge forming method and apparatusTOYOTA MOTOR CO LTD·Filed 1997·Granted Jul 27, 1999·15 cites·16 claims
- 0554US6339948B1Process of forming annular member from cylindrical member having radial flange at one endTOYOTA MOTOR CO LTD·Filed 2000·Granted Jan 22, 2002·5 cites·12 claims
- 0650US8246254B2Bearing structureKIKUKAWA DAISUKE·Filed 2008·Granted Aug 21, 2012·1 cites·5 claims
- 0746US5846851AMethod of applying adhesive to lead of lead frame and method of making semiconductor device using the sameHITACHI CABLE·Filed 1996·Granted Dec 8, 1998·15 cites·6 claims
- 0843US2010304908A1Shaft of belt-type continuously variable transmission, stationary sheave half for continuously variable transmission, method for production thereof, and continuously variable transmissionTOYOTA MOTOR CO LTD·Filed 2008·Application pending·0 cites
- 0939US2003201530A1Composite material member for semiconductor device and insulated and non-insulated semiconductor devices using composite material memberHITACHI LTD·Filed 2003·Application pending·0 cites
- 1038US2002191378A1Semiconductor power element heat dissipation board, and conductor plate therefor and heat sink material and solder materialHITACHI LTD·Filed 2002·Application pending·0 cites
- 1137US2002089828A1Semiconductor power element heat dissipation board, and conductor plate therefor and heat sink material and solder materialFiled 2001·Application pending·0 cites
- 1236US2001018381A1Carrier and method of manufacturing carrierFiled 2001·Application pending·0 cites
- 1335USRE37323EMethod for sticking an insulating film to a lead frameHITACHI CABLE·Filed 1999·Granted Aug 14, 2001·5 cites·4 claims
- 1434US4371741AComposite superconductorsJAPAN ATOMIC ENERGY RES INST·Filed 1981·Granted Feb 1, 1983·5 cites·9 claims
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