Inventor · disambiguated record
Satoshi Onai
Also filed as: ONAI SATOSHI
8 granted patents·8 pending applications·13 citations·filing 2004–2014
78Inventor score
Top patents by PatentIndex Score
16 records- 0173US7135380B2Method for manufacturing semiconductor deviceSANYO ELECTRIC CO·Filed 2005·Granted Nov 14, 2006·7 cites·4 claims
- 0268US8822593B2Curable resin composition, hardened material thereof, and optical semiconductor apparatusSHINETSU CHEMICAL CO·Filed 2013·Granted Sep 2, 2014·2 cites·20 claims
- 0357US8227341B2Semiconductor device and method of manufacturing the sameONAI SATOSHI·Filed 2009·Granted Jul 24, 2012·3 cites·7 claims
- 0456US9105821B2Curable silicone resin composition, cured product thereof and photosemiconductor apparatusSHINETSU CHEMICAL CO·Filed 2013·Granted Aug 11, 2015·1 cites·19 claims
- 0544US8013442B2Semiconductor device and manufacturing method thereofSEMICONDUCTOR COMPONENTS IND·Filed 2008·Granted Sep 6, 2011·0 cites·12 claims
- 0643US2008237853A1Semiconductor device and manufacturing method of the sameSANYO ELECTRIC CO·Filed 2008·Application pending·0 cites
- 0742US9403967B2Curable resin composition, cured product thereof and photosemiconductor apparatusSHINETSU CHEMICAL CO·Filed 2014·Granted Aug 2, 2016·0 cites·19 claims
- 0842US2013299859A1Substrate for optical semiconductor apparatus, method for manufacturing the same, optical semiconductor apparatus and method for manufacturing the sameSHINETSU CHEMICAL CO·Filed 2013·Application pending·0 cites
- 0942US2013299852A1Substrate for optical semiconductor apparatus, method for manufacturing the same, optical semiconductor apparatus, and method for manufacturing the sameSHINETSU CHEMICAL CO·Filed 2013·Application pending·0 cites
- 1042US2015102270A1Thermosetting conductive silicone composition, conductive adhesive comprising the same, conductive die bonding material comprising the same, and photosemiconductor apparatus having cured product of die bonding materialSHINETSU CHEMICAL CO·Filed 2014·Application pending·0 cites
- 1141US6875881B2Preparation of branched tetrasiloxaneSHINETSU CHEMICAL CO·Filed 2004·Granted Apr 5, 2005·0 cites·5 claims
- 1239US2013234341A1Interposer substrate manufacturing method and interposer substrateFUJIKURA LTD·Filed 2013·Application pending·0 cites
- 1338US2013241088A1Curable silicone resin composition and optoelectronic deviceSHINETSU CHEMICAL CO·Filed 2013·Application pending·0 cites
- 1436US8076781B2Semiconductor device and manufacturing method of the sameAMATATSU YOSHIMASA·Filed 2008·Granted Dec 13, 2011·0 cites·9 claims
- 1532US2006030119A1Method of manufacturing semiconductor deviceONAI SATOSHI·Filed 2005·Application pending·0 cites
- 1628US2006030111A1Method of manufacturing semiconductor deviceONAI SATOSHI·Filed 2005·Application pending·0 cites
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