Inventor · disambiguated record
Seng Hooi Ong
Also filed as: ONG SENG HOOI
3 granted patents·82 citations·filing 2000–2001
74Inventor score
Files withINTEL CORP3
Top patents by PatentIndex Score
3 records- 0187US6664483B2Electronic package with high density interconnect and associated methodsINTEL CORP·Filed 2001·Granted Dec 16, 2003·53 cites·34 claims
- 0274US6501166B2Stitched plane structure and process for package power delivery and dual referenced stripline I/O performanceINTEL CORP·Filed 2000·Granted Dec 31, 2002·19 cites·18 claims
- 0363US6429051B1Stitched plane structure for package power delivery and dual referenced stripline I/O performanceINTEL CORP·Filed 2001·Granted Aug 6, 2002·10 cites·9 claims
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