Inventor · disambiguated record
Chaung-Lin Lai
Also filed as: LAI Chaung-Lin
6 granted patents·3 pending applications·2 citations·filing 2016–2022
67Inventor score
Files withXINTEC INC9
Top patents by PatentIndex Score
9 records- 0174US9997473B2Chip package and method for forming the sameXINTEC INC·Filed 2017·Granted Jun 12, 2018·2 cites·23 claims
- 0267US11746003B2Chip packageXINTEC INC·Filed 2022·Granted Sep 5, 2023·0 cites·12 claims
- 0363US12237354B2Chip package and method for forming the sameXINTEC INC·Filed 2022·Granted Feb 25, 2025·0 cites·23 claims
- 0460US11319208B2Chip package and manufacturing method thereofXINTEC INC·Filed 2020·Granted May 3, 2022·0 cites·12 claims
- 0559US12272712B2Chip package and method for forming a chip package having first and second stack of dummy metal layers surround the sensing regionXINTEC INC·Filed 2022·Granted Apr 8, 2025·0 cites·15 claims
- 0655US2023230933A1Chip package and manufacturing method thereofXINTEC INC·Filed 2022·Application pending·0 cites
- 0741US10461117B2Semiconductor structure and method for manufacturing semiconductor structureXINTEC INC·Filed 2017·Granted Oct 29, 2019·0 cites·15 claims
- 0834US2017256496A1Chip package and method for forming the sameXINTEC INC·Filed 2017·Application pending·0 cites
- 0932US2017098678A1Chip scale sensing chip package and a manufacturing method thereofXINTEC INC·Filed 2016·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →