Inventor · disambiguated record
Roger D. St. Amand
Also filed as: ST AMAND ROGER · ST AMAND ROGER D
50 granted patents·7 pending applications·2,002 citations·filing 1997–2025
99Inventor score
Files withAMKOR TECHNOLOGY INC22AMKOR TECH SINGAPORE HOLDING PTE LTD13MICROCHIP TECH INC9ST AMAND ROGER D5ROA FERNANDO2
Top patents by PatentIndex Score
57 records- 0199US7932170B1Flip chip bump structure and fabrication methodAMKOR TECHNOLOGY INC·Filed 2008·Granted Apr 26, 2011·197 cites·16 claims
- 0298US9543242B1Semiconductor package and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2015·Granted Jan 10, 2017·73 cites·20 claims
- 0398US7859119B1Stacked flip chip die assemblyAMKOR TECHNOLOGY INC·Filed 2008·Granted Dec 28, 2010·82 cites·18 claims
- 0497US8633598B1Underfill contacting stacking balls package fabrication method and structureST AMAND ROGER D·Filed 2011·Granted Jan 21, 2014·53 cites·18 claims
- 0597US7132753B1Stacked die assembly having semiconductor die overhanging supportAMKOR TECHNOLOGY INC·Filed 2005·Granted Nov 7, 2006·74 cites·19 claims
- 0697US6930378B1Stacked semiconductor die assembly having at least one supportAMKOR TECHNOLOGY INC·Filed 2003·Granted Aug 16, 2005·178 cites·49 claims
- 0796US10192816B2Semiconductor package and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted Jan 29, 2019·15 cites·18 claims
- 0896US8482134B1Stackable package and methodDARVEAUX ROBERT FRANCIS·Filed 2010·Granted Jul 9, 2013·30 cites·4 claims
- 0996US7459776B1Stacked die assembly having semiconductor die projecting beyond supportAMKOR TECHNOLOGY INC·Filed 2006·Granted Dec 2, 2008·43 cites·19 claims
- 1096US6480110B2Inductively tunable antenna for a radio frequency identification tagMICROCHIP TECH INC·Filed 2000·Granted Nov 12, 2002·221 cites·33 claims
- 1196US6424263B1Radio frequency identification tag on a single layer substrateMICROCHIP TECH INC·Filed 2000·Granted Jul 23, 2002·150 cites·25 claims
- 1295US8796561B1Fan out build up substrate stackable package and methodSCANLAN CHRISTOPHER M·Filed 2009·Granted Aug 5, 2014·38 cites·17 claims
- 1395US7071568B1Stacked-die extension support structure and method thereofAMKOR TECHNOLOGY INC·Filed 2004·Granted Jul 4, 2006·103 cites·25 claims
- 1495US6463798B2Tire inflation pressure monitoring and location determining method and apparatusMICROCHIP TECH INC·Filed 2001·Granted Oct 15, 2002·200 cites·39 claims
- 1594US11652038B2Semiconductor package with front side and back side redistribution structures and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted May 16, 2023·2 cites·20 claims
- 1694US8129824B1Shielding for a semiconductor packageST AMAND ROGER D·Filed 2008·Granted Mar 6, 2012·54 cites·21 claims
- 1794US6571617B2Method and apparatus using directional antenna or learning modes for tire inflation pressure monitoring and location determinationMICROCHIP TECH INC·Filed 2001·Granted Jun 3, 2003·155 cites·14 claims
- 1894US6496113B2Radio frequency identification tag on a single layer substrateMICROCHIP TECH INC·Filed 2001·Granted Dec 17, 2002·104 cites·23 claims
- 1993US10347562B1Methods and structures for increasing the allowable die size in TMV packagesAMKOR TECHNOLOGY INC·Filed 2017·Granted Jul 9, 2019·7 cites·20 claims
- 2092US10943858B2Semiconductor package and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2019·Granted Mar 9, 2021·5 cites·20 claims
- 2192US9852976B2Semiconductor package and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted Dec 26, 2017·6 cites·20 claims
- 2292US7675180B1Stacked electronic component package having film-on-wire spacerAMKOR TECHNOLOGY INC·Filed 2006·Granted Mar 9, 2010·38 cites·19 claims
- 2392US2025372490A1Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
- 2491US9721872B1Methods and structures for increasing the allowable die size in TMV packagesNICHOLLS LOUIS W·Filed 2012·Granted Aug 1, 2017·16 cites·21 claims
- 2590US2025096107A1Semiconductor package and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 2688US8058715B1Package in package device for RF transceiver moduleROA FERNANDO·Filed 2009·Granted Nov 15, 2011·20 cites·12 claims
- 2788US7768135B1Semiconductor package with fast power-up cycle and method of making sameAMKOR TECHNOLOGY INC·Filed 2008·Granted Aug 3, 2010·15 cites·20 claims
- 2887US8390116B1Flip chip bump structure and fabrication methodHUEMOELLER RONALD PATRICK·Filed 2011·Granted Mar 5, 2013·7 cites·18 claims
- 2986US8558365B1Package in package device for RF transceiver moduleROA FERNANDO·Filed 2011·Granted Oct 15, 2013·10 cites·20 claims
- 3086US7755176B1Die-mounting substrate and method incorporating dummy traces for improving mounting film planarityAMKOR TECHNOLOGY INC·Filed 2005·Granted Jul 13, 2010·23 cites·15 claims
- 3185US8072083B1Stacked electronic component package having film-on-wire spacerST AMAND ROGER D·Filed 2010·Granted Dec 6, 2011·10 cites·17 claims
- 3284US8836115B1Stacked inverted flip chip package and fabrication methodST AMAND ROGER D·Filed 2008·Granted Sep 16, 2014·19 cites·13 claims
- 3383US12394699B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Granted Aug 19, 2025·0 cites·20 claims
- 3483US12159823B2Semiconductor package with front side and back side redistribution structures and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Granted Dec 3, 2024·0 cites·20 claims
- 3580US2024387230A1Carrier Assisted Substrate Method of Manufacturing an Electronic Device and Electronic Device Produced TherebyAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 3676US11876039B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Jan 16, 2024·0 cites·20 claims
- 3776US10818637B2Thin bonded interposer packageAMKOR TECHNOLOGY INC·Filed 2019·Granted Oct 27, 2020·1 cites·19 claims
- 3875US10714408B2Semiconductor devices and methods of making semiconductor devicesAMKOR TECHNOLOGY INC·Filed 2019·Granted Jul 14, 2020·1 cites·21 claims
- 3973US8704369B1Flip chip bump structure and fabrication methodAMKOR TECHNOLOGY INC·Filed 2013·Granted Apr 22, 2014·2 cites·20 claims
- 4071US12051611B2Carrier assisted substrate method of manufacturing an electronic device and electronic device produced therebyAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Jul 30, 2024·0 cites·14 claims
- 4171US11621243B2Thin bonded interposer packageAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Apr 4, 2023·0 cites·19 claims
- 4270US11488892B2Methods and structures for increasing the allowable die size in TMV packagesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Nov 1, 2022·0 cites·20 claims
- 4369US11362027B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Jun 14, 2022·0 cites·19 claims
- 4465US6208500B1High quality factor capacitorMICROCHIP TECH INC·Filed 1998·Granted Mar 27, 2001·24 cites·5 claims
- 4564US9496210B1Stackable package and methodAMKOR TECHNOLOGY INC·Filed 2013·Granted Nov 15, 2016·1 cites·10 claims
- 4661US11018040B2Carrier assisted substrate method of manufacturing an electronic device and electronic device produced therebyAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted May 25, 2021·0 cites·17 claims
- 4757US10242966B1Thin bonded interposer packageAMKOR TECHNOLOGY INC·Filed 2017·Granted Mar 26, 2019·0 cites·20 claims
- 4855US12009343B1Stackable package and methodAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2016·Granted Jun 11, 2024·0 cites·18 claims
- 4955US8890337B1Column and stacking balls package fabrication method and structureAMKOR TECHNOLOGY INC·Filed 2014·Granted Nov 18, 2014·0 cites·24 claims
- 5055US6087241AMethod of forming side dielectrically isolated semiconductor devices and MOS semiconductor devices fabricated by this methodMICROCHIP TECH INC·Filed 1998·Granted Jul 11, 2000·21 cites·12 claims
Showing the top 50 of 57 patent records by PatentIndex Score.
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