Inventor · disambiguated record
Kuniko Miyakawa
Also filed as: MIYAKAWA KUNIKO
10 granted patents·216 citations·filing 1991–1998
91Inventor score
Files withNEC CORP10
Top patents by PatentIndex Score
10 records- 0178US5686760AEutectic Cu-alloy wiring structure in a semiconductor deviceNEC CORP·Filed 1995·Granted Nov 11, 1997·58 cites·9 claims
- 0273US5169803AMethod of filling contact holes of a semiconductor deviceNEC CORP·Filed 1991·Granted Dec 8, 1992·45 cites·11 claims
- 0365US5543357AProcess of manufacturing a semiconductor device by filling a via hole in an interlayered film of the device with wiring metalNEC CORP·Filed 1994·Granted Aug 6, 1996·27 cites·5 claims
- 0458US5278449ASemiconductor memory deviceNEC CORP·Filed 1992·Granted Jan 11, 1994·23 cites·7 claims
- 0554US5880505AC49-structured tungsten-containing titanium salicide structureNEC CORP·Filed 1997·Granted Mar 9, 1999·11 cites·23 claims
- 0651US6114765AC49-structured tungsten-containing titanium salicide structure and method of forming the sameNEC CORP·Filed 1998·Granted Sep 5, 2000·9 cites·23 claims
- 0749US5869397AMethod of manufacturing semiconductor deviceNEC CORP·Filed 1998·Granted Feb 9, 1999·12 cites·7 claims
- 0848US5851915AMethod of manufacturing a semiconductor device through a reduced number of simple processes at a relatively low costNEC CORP·Filed 1997·Granted Dec 22, 1998·16 cites·21 claims
- 0941US6069045AMethod of forming C49-structure tungsten-containing titanium salicide structureNEC CORP·Filed 1998·Granted May 30, 2000·5 cites·50 claims
- 1040US5990005AMethod of burying a contact hole with a metal for forming multilevel interconnectionsNEC CORP·Filed 1997·Granted Nov 23, 1999·10 cites·100 claims
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