Inventor · disambiguated record
Wanil Lee
Also filed as: LEE WANIL
6 granted patents·2 pending applications·14 citations·filing 2015–2025
75Inventor score
Top patents by PatentIndex Score
8 records- 0194US10937741B2Molded laser package with electromagnetic interference shield and method of makingSTATS CHIPPAC PTE LTD·Filed 2018·Granted Mar 2, 2021·10 cites·25 claims
- 0285US10636756B2Semiconductor device and method of forming protrusion E-bar for 3D SIPSTATS CHIPPAC PTE LTD·Filed 2018·Granted Apr 28, 2020·4 cites·25 claims
- 0379US12266614B2Molded laser package with electromagnetic interference shield and method of makingSTATS CHIPPAC PTE LTD·Filed 2023·Granted Apr 1, 2025·0 cites·25 claims
- 0479US2025201730A1Molded Laser Package with Electromagnetic Interference Shield and Method of MakingSTATS CHIPPAC PTE LTD·Filed 2025·Application pending·0 cites
- 0572US11587882B2Molded laser package with electromagnetic interference shield and method of makingSTATS CHIPPAC PTE LTD·Filed 2021·Granted Feb 21, 2023·0 cites·17 claims
- 0660US11342294B2Semiconductor device and method of forming protrusion e-bar for 3D SiPSTATS CHIPPAC PTE LTD·Filed 2020·Granted May 24, 2022·0 cites·22 claims
- 0747US11935777B2Semiconductor manufacturing equipment and method of providing support base with filling material disposed into openings in semiconductor wafer for supportSTATS CHIPPAC PTE LTD·Filed 2021·Granted Mar 19, 2024·0 cites·25 claims
- 0828US2015318259A1Integrated circuit packaging system with no-reflow connection and method of manufacture thereofKIM KYUNGOE·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →