Inventor · disambiguated record
Yukihiko Toyoda
Also filed as: TOYODA YUKIHIKO
15 granted patents·1 pending application·235 citations·filing 1999–2012
94Inventor score
Top patents by PatentIndex Score
16 records- 0196US7504719B2Printed wiring board having a roughened surface formed on a metal layer, and method for producing the sameIBIDEN CO LTD·Filed 2005·Granted Mar 17, 2009·33 cites·16 claims
- 0294US8018045B2Printed circuit boardIBIDEN CO LTD·Filed 2008·Granted Sep 13, 2011·18 cites·23 claims
- 0393US7535095B1Printed wiring board and method for producing the sameIBIDEN CO LTD·Filed 1999·Granted May 19, 2009·59 cites·13 claims
- 0491US8020291B2Method of manufacturing a printed wiring boardIBIDEN CO LTD·Filed 2008·Granted Sep 20, 2011·13 cites·10 claims
- 0589US8006377B2Method for producing a printed wiring boardIBIDEN CO LTD·Filed 2008·Granted Aug 30, 2011·9 cites·13 claims
- 0689US7371974B2Multilayer printed wiring boardIBIDEN CO LTD·Filed 2002·Granted May 13, 2008·43 cites·36 claims
- 0787US8030577B2Printed wiring board and method for producing the sameIBIDEN CO LTD·Filed 2008·Granted Oct 4, 2011·9 cites·15 claims
- 0883US7916492B1Multilayered printed circuit boardIBIDEN CO LTD·Filed 2000·Granted Mar 29, 2011·25 cites·6 claims
- 0982US7994433B2Printed wiring board and method for producing the sameIBIDEN CO LTD·Filed 2009·Granted Aug 9, 2011·6 cites·8 claims
- 1082US7910836B2Multilayered printed circuit board, solder resist composition, and semiconductor deviceIBIDEN CO LTD·Filed 2007·Granted Mar 22, 2011·8 cites·7 claims
- 1176US8093507B2Printed wiring board and method for producing the sameEN HONCHIN·Filed 2009·Granted Jan 10, 2012·3 cites·19 claims
- 1275US8533943B2Printed wiring board and method for producing the sameEN HONCHIN·Filed 2009·Granted Sep 17, 2013·4 cites·7 claims
- 1370US8030579B2Multilayer printed wiring boardIBIDEN CO LTD·Filed 2008·Granted Oct 4, 2011·3 cites·40 claims
- 1469US9040843B2Multilayer printed wiring boardTOYODA YUKIHIKO·Filed 2012·Granted May 26, 2015·2 cites·22 claims
- 1552US2010163288A1Multilayered printed circuit boardIBIDEN CO LTD·Filed 2010·Application pending·0 cites
- 1648US8324512B2Multilayer printed wiring boardTOYODA YUKIHIKO·Filed 2011·Granted Dec 4, 2012·0 cites·35 claims
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