Inventor · disambiguated record
Alan M. Schoepp
Also filed as: SCHOEPP ALAN · SCHOEPP ALAN M
43 granted patents·11 pending applications·1,978 citations·filing 1998–2025
98Inventor score
Top patents by PatentIndex Score
54 records- 0199US9431268B2Isotropic atomic layer etch for silicon and germanium oxidesLAM RES CORP·Filed 2015·Granted Aug 30, 2016·135 cites·20 claims
- 0299US7858898B2Bevel etcher with gap controlLAM RES CORP·Filed 2007·Granted Dec 28, 2010·349 cites·19 claims
- 0399US6320320B1Method and apparatus for producing uniform process ratesLAM RES CORP·Filed 1999·Granted Nov 20, 2001·411 cites·40 claims
- 0498US6170429B1Chamber liner for semiconductor process chambersLAM RES CORP·Filed 1998·Granted Jan 9, 2001·233 cites·15 claims
- 0596US6341574B1Plasma processing systemsLAM RES CORP·Filed 1999·Granted Jan 29, 2002·135 cites·2 claims
- 0696US6277237B1Chamber liner for semiconductor process chambersLAM RES CORP·Filed 2000·Granted Aug 21, 2001·75 cites·12 claims
- 0794US9982341B2Modular vaporizerLAM RES CORP·Filed 2015·Granted May 29, 2018·7 cites·23 claims
- 0894US7943007B2Configurable bevel etcherLAM RES CORP·Filed 2007·Granted May 17, 2011·24 cites·11 claims
- 0994US6669783B2High temperature electrostatic chuckLAM RES CORP·Filed 2001·Granted Dec 30, 2003·92 cites·29 claims
- 1093US8580078B2Bevel etcher with vacuum chuckBAILEY III ANDREW D·Filed 2007·Granted Nov 12, 2013·20 cites·11 claims
- 1192US8898928B2Delamination drying apparatus and methodLAM RES CORP·Filed 2012·Granted Dec 2, 2014·18 cites·19 claims
- 1292US6464843B1Contamination controlling method and apparatus for a plasma processing chamberLAM RES CORP·Filed 1999·Granted Oct 15, 2002·75 cites·28 claims
- 1392US6322661B1Method and apparatus for controlling the volume of a plasmaLAM RES CORP·Filed 1999·Granted Nov 27, 2001·75 cites·48 claims
- 1491US8721908B2Bevel etcher with vacuum chuckLAM RES CORP·Filed 2013·Granted May 13, 2014·9 cites·13 claims
- 1586US6361645B1Method and device for compensating wafer bias in a plasma processing chamberLAM RES CORP·Filed 1998·Granted Mar 26, 2002·83 cites·32 claims
- 1685US9053925B2Configurable bevel etcherBAILEY III ANDREW D·Filed 2011·Granted Jun 9, 2015·6 cites·13 claims
- 1784US9673037B2Substrate freeze dry apparatus and methodSIRARD STEPHEN M·Filed 2011·Granted Jun 6, 2017·9 cites·11 claims
- 1884US7662254B2Methods of and apparatus for aligning electrodes in a process chamber to protect an exclusion area within an edge environ of a waferLAM RES CORP·Filed 2007·Granted Feb 16, 2010·8 cites·12 claims
- 1984US6302966B1Temperature control system for plasma processing apparatusLAM RES CORP·Filed 1999·Granted Oct 16, 2001·42 cites·26 claims
- 2083US6518705B2Method and apparatus for producing uniform process ratesLAM RES CORP·Filed 2001·Granted Feb 11, 2003·16 cites·16 claims
- 2178US11984330B2Atomic layer etch and deposition processing systems including a lens circuit with a tele-centric lens, an optical beam folding assembly, or a polygon scannerLAM RES CORP·Filed 2019·Granted May 14, 2024·2 cites·26 claims
- 2278US6074516AHigh sputter, etch resistant window for plasma processing chambersLAM RES CORP·Filed 1998·Granted Jun 13, 2000·30 cites·18 claims
- 2377US7922866B2Apparatus for aligning electrodes in a process chamber to protect an exclusion area within an edge environ of a waferLAM RES CORP·Filed 2009·Granted Apr 12, 2011·4 cites·12 claims
- 2476US7542134B2System, method and apparatus for in-situ substrate inspectionLAM RES CORP·Filed 2008·Granted Jun 2, 2009·4 cites·9 claims
- 2576US6653791B1Method and apparatus for producing uniform process ratesLAM RES CORP·Filed 2001·Granted Nov 25, 2003·10 cites·2 claims
- 2676US6567258B2High temperature electrostatic chuckLAM RES CORP·Filed 2002·Granted May 20, 2003·17 cites·12 claims
- 2775US9117860B2Controlled ambient system for interface engineeringBOYD JOHN·Filed 2006·Granted Aug 25, 2015·5 cites·13 claims
- 2875US6377437B1High temperature electrostatic chuckLAM RES CORP·Filed 1999·Granted Apr 23, 2002·41 cites·27 claims
- 2972US7625452B2Apparatuses and methods for cleaning a substrateLAM RES CORP·Filed 2008·Granted Dec 1, 2009·2 cites·7 claims
- 3070US12198896B2Compact high density plasma sourceLAM RES CORP·Filed 2019·Granted Jan 14, 2025·1 cites·11 claims
- 3169US2025291253A1Apparatus for photoresist dry depositionLAM RES CORP·Filed 2025·Application pending·0 cites
- 3268US8314027B2Wafer electroless plating system and associated methodsTHIE WILLIAM·Filed 2011·Granted Nov 20, 2012·2 cites·15 claims
- 3363US6306244B1Apparatus for reducing polymer deposition on substrate supportLAM RES CORP·Filed 1999·Granted Oct 23, 2001·28 cites·29 claims
- 3461US8485120B2Method and apparatus for wafer electroless platingTHIE WILLIAM·Filed 2007·Granted Jul 16, 2013·1 cites·14 claims
- 3560US2025332662A1Atomic layer etch and deposition processing systems including a lens circuit with a tele-centric lens, an optical beam folding assembly, or a polygon scannerPAENG DONG WOO·Filed 2024·Application pending·0 cites
- 3658US10107490B2Configurable liquid precursor vaporizerLAM RES CORP·Filed 2014·Granted Oct 23, 2018·0 cites·18 claims
- 3757US8069813B2Wafer electroless plating system and associated methodsTHIE WILLIAM·Filed 2007·Granted Dec 6, 2011·1 cites·18 claims
- 3856US8083207B1Apparatus for gate valve movement in a minimum-space wet process environmentWYLIE JACOB·Filed 2008·Granted Dec 27, 2011·4 cites·14 claims
- 3956US7441299B2Apparatuses and methods for cleaning a substrateLAM RES CORP·Filed 2004·Granted Oct 28, 2008·3 cites·19 claims
- 4056US7397555B2System, method and apparatus for in-situ substrate inspectionLAM RES CORP·Filed 2004·Granted Jul 8, 2008·1 cites·10 claims
- 4156US2022308462A1Apparatus for photoresist dry depositionLAM RES CORP·Filed 2020·Application pending·0 cites
- 4254US10808317B2Deposition apparatus including an isothermal processing zoneLAM RES CORP·Filed 2013·Granted Oct 20, 2020·0 cites·16 claims
- 4353US2006011583A1Materials and gas chemistries for processing systemsBAILEY ANDREW D III·Filed 2005·Application pending·0 cites
- 4453US2004011467A1Materials and gas chemistries for processing systemsFiled 2003·Application pending·0 cites
- 4552US9287110B2Method and apparatus for wafer electroless platingLAM RES CORP·Filed 2013·Granted Mar 15, 2016·0 cites·20 claims
- 4652US8940098B2Method for distributing gas for a bevel etcherLAM RES CORP·Filed 2013·Granted Jan 27, 2015·0 cites·6 claims
- 4750US8398875B2Method of orienting an upper electrode relative to a lower electrode for bevel edge processingSEXTON GREGORY S·Filed 2011·Granted Mar 19, 2013·0 cites·13 claims
- 4849US2023260759A1Integration of vapor deposition process into plasma etch reactorLAM RES CORP·Filed 2021·Application pending·0 cites
- 4946US2024295025A1Dual plenum fractal showerheadLAM RES CORP·Filed 2020·Application pending·0 cites
- 5043US8844461B2Fluid handling system for wafer electroless plating and associated methodsTHIE WILLIAM·Filed 2007·Granted Sep 30, 2014·0 cites·23 claims
Showing the top 50 of 54 patent records by PatentIndex Score.
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