Inventor · disambiguated record
Jinchan Ahn
Also filed as: AHN JINCHAN
9 granted patents·4 pending applications·1 citations·filing 2016–2024
76Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD13
Top patents by PatentIndex Score
13 records- 0170US11894242B2Semiconductor package and method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Feb 6, 2024·0 cites·20 claims
- 0270US10714438B2Semiconductor device having metal bump and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jul 14, 2020·1 cites·25 claims
- 0364US11037894B2Semiconductor device having metal bump and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 15, 2021·0 cites·20 claims
- 0463US11610786B2Semiconductor package and method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 21, 2023·0 cites·14 claims
- 0562US11869878B2Semiconductor module including a semiconductor package connected to a module substrate and a bonding wireSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 9, 2024·0 cites·14 claims
- 0662US2025226366A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0760US2025218800A1Semiconductor device, semiconductor package, and printed circuit board having a patternSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0859US2025029914A1Semiconductor package with backside power delivery network layerSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0957US2025149519A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1056US11171119B2Semiconductor module including a semiconductor package connected to a module substrate and a bonding wireSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 9, 2021·0 cites·10 claims
- 1150US10141255B2Circuit boards and semiconductor packages including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 27, 2018·0 cites·20 claims
- 1248US12154889B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 26, 2024·0 cites·20 claims
- 1347US10002822B2Circuit boards and semiconductor packages including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jun 19, 2018·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →