Inventor · disambiguated record
Harunari Hasegawa
Also filed as: HASEGAWA HARUNARI
10 granted patents·1 pending application·163 citations·filing 2001–2020
89Inventor score
Top patents by PatentIndex Score
11 records- 0194US7072578B2Carbon wire heating object sealing heater and fluid heating apparatus using the same heaterTOKYO ELECTRON LTD·Filed 2005·Granted Jul 4, 2006·44 cites·4 claims
- 0290US9163311B2Film forming apparatusHASEGAWA HARUNARI·Filed 2011·Granted Oct 20, 2015·16 cites·6 claims
- 0386US6885814B2Carbon wire heating object sealing heater and fluid heating apparatus using the same heaterTOKYO ELECTRON LTD·Filed 2003·Granted Apr 26, 2005·36 cites·27 claims
- 0480US6903030B2System and method for heat treating semiconductorTOKYO ELECTRON LTD·Filed 2002·Granted Jun 7, 2005·26 cites·32 claims
- 0580US6516143B2Fluid heating apparatusTOSHIBA CERAMICS CO·Filed 2001·Granted Feb 4, 2003·27 cites·22 claims
- 0674USD932725SCartTOKYO ELECTRON LTD·Filed 2020·Granted Oct 5, 2021·6 cites·1 claims
- 0774USD923902SCartTOKYO ELECTRON LTD·Filed 2020·Granted Jun 29, 2021·6 cites·1 claims
- 0856USD937526SCartTOKYO ELECTRON LTD·Filed 2020·Granted Nov 30, 2021·2 cites·1 claims
- 0955US10518986B2Method for conveying reaction tube unitTOKYO ELECTRON LTD·Filed 2019·Granted Dec 31, 2019·0 cites·14 claims
- 1049US11114318B2Assembling apparatus and assembling method for semiconductor manufacturing apparatusTOKYO ELECTRON LTD·Filed 2019·Granted Sep 7, 2021·0 cites·11 claims
- 1135US2012160169A1Film forming apparatusHASEGAWA HARUNARI·Filed 2011·Application pending·0 cites
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