Inventor · disambiguated record
Lucien J. Bissey
Also filed as: BISSEY LUCIEN J
26 granted patents·4 pending applications·618 citations·filing 1997–2025
97Inventor score
Top patents by PatentIndex Score
30 records- 0198US6794699B2Annular gate and technique for fabricating an annular gateMICRON TECHNOLOGY INC·Filed 2002·Granted Sep 21, 2004·172 cites·107 claims
- 0293US7205598B2Random access memory device utilizing a vertically oriented select transistorMICRON TECHNOLOGY INC·Filed 2003·Granted Apr 17, 2007·60 cites·32 claims
- 0391US7777264B2Random access memory device utilizing a vertically oriented select transistorMICRON TECHNOLOGY INC·Filed 2007·Granted Aug 17, 2010·15 cites·28 claims
- 0488US6504236B2Semiconductor die assembly having leadframe decoupling characters and methodMICRON TECHNOLOGY INC·Filed 2001·Granted Jan 7, 2003·37 cites·54 claims
- 0588US6054754AMulti-capacitance lead frame decoupling deviceMICRON TECHNOLOGY INC·Filed 1997·Granted Apr 25, 2000·69 cites·65 claims
- 0687US6184574B1Multi-capacitance lead frame decoupling deviceMICRON TECHNOLOGY INC·Filed 1999·Granted Feb 6, 2001·63 cites·65 claims
- 0783US6841438B2Annular gate and technique for fabricating an annular gateMICRON TECHNOLOGY INC·Filed 2003·Granted Jan 11, 2005·27 cites·27 claims
- 0882US6781219B2Semiconductor die assembly having leadframe decoupling charactersMICRON TECHNOLOGY INC·Filed 2002·Granted Aug 24, 2004·22 cites·54 claims
- 0982US6356474B1Efficient open-array memory device architecture and methodMICRON TECHNOLOGY INC·Filed 2000·Granted Mar 12, 2002·31 cites·54 claims
- 1080US6310388B1Semiconductor die assembly having leadframe decoupling charactersMICRON TECHNOLOGY INC·Filed 2000·Granted Oct 30, 2001·21 cites·58 claims
- 1177US7432197B2Methods of patterning photoresist, and methods of forming semiconductor constructionsMICRON TECHNOLOGY INC·Filed 2006·Granted Oct 7, 2008·4 cites·38 claims
- 1276US2024086337A1Data integrity protection for relocating data in a memory systemMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 1374US2025156338A1Data integrity protection for relocating data in a memory systemMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 1472US8431980B2Random access memory device utilizing a vertically oriented select transistorVOSHELL THOMAS W·Filed 2010·Granted Apr 30, 2013·3 cites·20 claims
- 1571US6951789B2Method of fabricating a random access memory device utilizing a vertically oriented select transistorMICRON TECHNOLOGY INC·Filed 2004·Granted Oct 4, 2005·11 cites·26 claims
- 1670US6169696B1Method and apparatus for stress testing a semiconductor memoryMICRON TECHNOLOGY INC·Filed 1999·Granted Jan 2, 2001·21 cites·12 claims
- 1767US7276754B2Annular gate and technique for fabricating an annular gateMICRON TECHNOLOGY INC·Filed 2004·Granted Oct 2, 2007·10 cites·20 claims
- 1862US11822489B2Data integrity protection for relocating data in a memory systemMICRON TECHNOLOGY INC·Filed 2018·Granted Nov 21, 2023·0 cites·21 claims
- 1961US5848017AMethod and apparatus for stress testing a semiconductor memoryMICRON TECHNOLOGY INC·Filed 1997·Granted Dec 8, 1998·15 cites·20 claims
- 2058US7964503B2Methods of patterning photoresist, and methods of forming semiconductor constructionsMICRON TECHNOLOGY INC·Filed 2008·Granted Jun 21, 2011·0 cites·15 claims
- 2155US6172929B1Integrated circuit having aligned fuses and methods for forming and programming the fusesMICRON TECHNOLOGY INC·Filed 1999·Granted Jan 9, 2001·14 cites·47 claims
- 2253US6784043B2Methods for forming aligned fuses disposed in an integrated circuitMICRON TECHNOLOGY INC·Filed 2003·Granted Aug 31, 2004·7 cites·23 claims
- 2352US5999467AMethod and apparatus for stress testing a semiconductor memoryMICRON TECHNOLOGY INC·Filed 1998·Granted Dec 7, 1999·10 cites·17 claims
- 2448US6522595B2Methods for forming and programming aligned fuses disposed in an integrated circuitMICRON TECHNOLOGY INC·Filed 2001·Granted Feb 18, 2003·5 cites·26 claims
- 2546US8785989B2Semiconductor constructionsBISSEY LUCIEN J·Filed 2011·Granted Jul 22, 2014·0 cites·13 claims
- 2640US2005023621A1Electrostatic discharge protection devices having transistors with textured surfacesMICRON TECHNOLOGY INC·Filed 2004·Application pending·0 cites
- 2738US2004036131A1Electrostatic discharge protection devices having transistors with textured surfacesMICRON TECHNOLOGY INC·Filed 2002·Application pending·0 cites
- 2836US6642084B2Methods for forming aligned fuses disposed in an integrated circuitMICRON TECHNOLOGY INC·Filed 2002·Granted Nov 4, 2003·1 cites·17 claims
- 2930US6235622B1Method and apparatus for isolating a conductive region from a substrate during manufacture of an integrated circuit and connected to the substrate after manufactureMICRON TECHNOLOGY INC·Filed 1999·Granted May 22, 2001·0 cites·16 claims
- 3030US6137119AApparatus for isolating a conductive region from a substrate during manufacture of an integrated circuit and connecting the conductive region to the substrate after manufactureMICRON TECHNOLOGY INC·Filed 1998·Granted Oct 24, 2000·0 cites·34 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →