Inventor · disambiguated record
Vipul V. Mehta
Also filed as: MEHTA VIPUL · MEHTA VIPUL V · MEHTA VIPUL VIJAY
19 granted patents·4 pending applications·20 citations·filing 2012–2024
90Inventor score
Top patents by PatentIndex Score
23 records- 0196US11664290B2Package with underfill containment barrierINTEL CORP·Filed 2021·Granted May 30, 2023·3 cites·20 claims
- 0289US11158558B2Package with underfill containment barrierINTEL CORP·Filed 2016·Granted Oct 26, 2021·5 cites·16 claims
- 0384US12327773B2Package with underfill containment barrierINTEL CORP·Filed 2024·Granted Jun 10, 2025·0 cites·20 claims
- 0480US11935805B2Package with underfill containment barrierINTEL CORP·Filed 2023·Granted Mar 19, 2024·0 cites·20 claims
- 0580US10403578B2Electronic device packageINTEL CORP·Filed 2017·Granted Sep 3, 2019·3 cites·24 claims
- 0679US10373888B2Electronic package assembly with compact die placementINTEL CORP·Filed 2016·Granted Aug 6, 2019·3 cites·13 claims
- 0778US11282717B2Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gapINTEL CORP·Filed 2018·Granted Mar 22, 2022·2 cites·12 claims
- 0877US12362250B2Protruding SN substrate features for epoxy flow controlINTEL CORP·Filed 2024·Granted Jul 15, 2025·0 cites·19 claims
- 0976US12009271B2Protruding SN substrate features for epoxy flow controlINTEL CORP·Filed 2019·Granted Jun 11, 2024·2 cites·26 claims
- 1075US11688634B2Trenches in wafer level packages for improvements in warpage reliability and thermalsINTEL CORP·Filed 2019·Granted Jun 27, 2023·2 cites·27 claims
- 1169US11776821B2Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gapINTEL CORP·Filed 2022·Granted Oct 3, 2023·0 cites·19 claims
- 1269US2024402445A1Hydrophobic feature to control adhesive flowINTEL CORP·Filed 2024·Application pending·0 cites
- 1368US11545441B2Semiconductor package having wafer-level active die and external die mountINTEL CORP·Filed 2020·Granted Jan 3, 2023·0 cites·16 claims
- 1462US12130482B2Hydrophobic feature to control adhesive flowINTEL CORP·Filed 2020·Granted Oct 29, 2024·0 cites·19 claims
- 1555US10910317B2Semiconductor package having wafer-level active die and external die mountINTEL CORP·Filed 2016·Granted Feb 2, 2021·0 cites·20 claims
- 1653US11749585B2High thermal conductivity, high modulus structure within a mold material layer of an integrated circuit packageINTEL CORP·Filed 2020·Granted Sep 5, 2023·0 cites·20 claims
- 1753US11676876B2Semiconductor die package with warpage management and process for forming suchINTEL CORP·Filed 2019·Granted Jun 13, 2023·0 cites·26 claims
- 1851US2024153837A1Barrier enabled cuf and mold process for multi-chip packagingINTEL CORP·Filed 2022·Application pending·0 cites
- 1948US10290592B2Semiconductor package, and a method for forming a semiconductor packageINTEL CORP·Filed 2017·Granted May 14, 2019·0 cites·24 claims
- 2043US12002727B2Barrier structures for underfill containmentINTEL CORP·Filed 2020·Granted Jun 4, 2024·0 cites·13 claims
- 2141US2021066162A1Semiconductor package with attachment and/or stop structuresINTEL CORP·Filed 2019·Application pending·0 cites
- 2237US8895365B2Techniques and configurations for surface treatment of an integrated circuit substrateRAMALINGAM SURIYAKALA·Filed 2012·Granted Nov 25, 2014·0 cites·10 claims
- 2336US2020006169A1Micro-electronic package with barrier structureINTEL CORP·Filed 2018·Application pending·0 cites
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