Inventor · disambiguated record
Yadong Bai
Also filed as: BAI YADONG
6 granted patents·3 citations·filing 2012–2020
69Inventor score
Top patents by PatentIndex Score
6 records- 0171US9839167B2Electronic component package structure and electronic deviceHUAWEI TECH CO LTD·Filed 2015·Granted Dec 5, 2017·2 cites·15 claims
- 0264US9160244B2Magnetic integration double-ended converterHUAWEI TECH CO LTD·Filed 2014·Granted Oct 13, 2015·1 cites·6 claims
- 0350US10091915B2Electronic component package structure and electronic deviceHUAWEI TECH CO LTD·Filed 2017·Granted Oct 2, 2018·0 cites·10 claims
- 0446US8848397B2Magnetic integration double-ended converterLU ZENGYI·Filed 2012·Granted Sep 30, 2014·0 cites·15 claims
- 0543US11387226B2Chip power supply system, chip, PCB, and computer deviceHUAWEI TECH CO LTD·Filed 2020·Granted Jul 12, 2022·0 cites·20 claims
- 0643US9484311B2Chip package and packaging methodHUAWEI TECH CO LTD·Filed 2014·Granted Nov 1, 2016·0 cites·15 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →