Inventor · disambiguated record
Seunghun Han
Also filed as: HAN SEUNGHUN
14 granted patents·4 pending applications·8 citations·filing 2013–2023
85Inventor score
Files withELECTRONICS & TELECOMMUNICATIONS RES INST3LG CHEMICAL LTD3SAMSUNG ELECTRONICS CO LTD3KIM SANG-UK2GREEN POWER CO LTD1
Top patents by PatentIndex Score
18 records- 0180US11634575B2Thermoplastic resin composition, method of preparing the same, and molded article including the sameLG CHEMICAL LTD·Filed 2019·Granted Apr 25, 2023·1 cites·11 claims
- 0279US11335668B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 17, 2022·1 cites·20 claims
- 0377US9606413B2Reflective display particle, reflective display device, and method for manufacturing the sameNANOBRICK CO LTD·Filed 2015·Granted Mar 28, 2017·3 cites·6 claims
- 0476US12119329B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 15, 2024·0 cites·20 claims
- 0572US9385109B2Semiconductor packages having trench-shaped opening and methods for fabricating the sameKIM SANGWON·Filed 2014·Granted Jul 5, 2016·3 cites·20 claims
- 0671US11769755B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 26, 2023·0 cites·20 claims
- 0770US12180357B2ABS-based resin composition, method of preparing the same, and molded article including the sameLG CHEMICAL LTD·Filed 2021·Granted Dec 31, 2024·0 cites·14 claims
- 0866US2023275255A1Electrode assembly, and secondary battery comprising electrode assemblySAMSUNG SDI CO LTD·Filed 2023·Application pending·0 cites
- 0964US12365792B2Thermoplastic resin composition, method of preparing the same, and molded article manufactured using the sameLG CHEMICAL LTD·Filed 2021·Granted Jul 22, 2025·0 cites·14 claims
- 1055US10885201B2Apparatus for quantifying security of open-source software package, and apparatus and method for optimizing open-source software packageELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2019·Granted Jan 5, 2021·0 cites·6 claims
- 1154US12321116B2Fuser comprising heat transfer member for preventing overheat of fusing beltHEWLETT PACKARD DEVELOPMENT CO·Filed 2022·Granted Jun 3, 2025·0 cites·11 claims
- 1253US12263742B2Wireless charging systemGREEN POWER CO LTD·Filed 2021·Granted Apr 1, 2025·0 cites·19 claims
- 1348US10430590B2Apparatus for quantifying security of open-source software package, and apparatus and method for optimizing open-source software packageELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2017·Granted Oct 1, 2019·0 cites·2 claims
- 1448US2014151863A1Semiconductor packages and methods of fabricating the sameKIM SANG-UK·Filed 2013·Application pending·0 cites
- 1547US10771462B2User terminal using cloud service, integrated security management server for user terminal, and integrated security management method for user terminalELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2018·Granted Sep 8, 2020·0 cites·20 claims
- 1643US2015270242A1Semiconductor packages and methods of fabricating the sameKIM SANG-UK·Filed 2015·Application pending·0 cites
- 1742US2014346667A1Semiconductor package and method of fabricating the sameHAN SEUNGHUN·Filed 2014·Application pending·0 cites
- 1840US10685613B2Liquid crystal display device, controller thereof, and driving method thereofLG DISPLAY CO LTD·Filed 2018·Granted Jun 16, 2020·0 cites·17 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →