Assignee
SUSS MICROTEC AG
DE·3 granted patents·14 citations·filing 2008–2008
Top patents by PatentIndex Score
3 records- 0179US7732320B2Apparatus and method for semiconductor wafer bumping via injection molded solderSUSS MICROTEC AG·Filed 2008·Granted Jun 8, 2010·6 cites·33 claims
- 0276US7703658B2Apparatus and method for semiconductor wafer bumping via injection molded solderSUSS MICROTEC AG·Filed 2008·Granted Apr 27, 2010·6 cites·19 claims
- 0362US7790596B2Apparatus and method for semiconductor wafer bumping via injection molded solderSUSS MICROTEC AG·Filed 2008·Granted Sep 7, 2010·2 cites·12 claims
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