Assignee
SUMITOMO METAL ELECTRONICS DEV
JP·2 granted patents·1 pending application·66 citations·filing 1996–2003
Top patents by PatentIndex Score
3 records- 0166US5814366AMethod of manufacturing multilayered ceramic substrateSUMITOMO METAL ELECTRONICS DEV·Filed 1996·Granted Sep 29, 1998·40 cites·11 claims
- 0256US5847326ALow-temperature fired ceramic circuit substrate with improved Ag-Au connection reliabilitySUMITOMO METAL ELECTRONICS DEV·Filed 1997·Granted Dec 8, 1998·26 cites·9 claims
- 0331US2004040856A1Method for making plastic packagesSUMITOMO METAL ELECTRONICS DEV·Filed 2003·Application pending·0 cites
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