Assignee
STMICROELECTRONICS SDN BHD
MY·5 granted patents·2 pending applications·25 citations·filing 2002–2021
Top patents by PatentIndex Score
7 records- 0186US9679832B1Rough leadframe with a nanolayer of silverSTMICROELECTRONICS SDN BHD·Filed 2016·Granted Jun 13, 2017·22 cites·20 claims
- 0244US2022157681A1Integrated circuit package with v-shaped notch creepage structureSTMICROELECTRONICS SDN BHD·Filed 2021·Application pending·0 cites
- 0343US11862540B2Mold flow balancing for a matrix leadframeSTMICROELECTRONICS SDN BHD·Filed 2021·Granted Jan 2, 2024·0 cites·10 claims
- 0438US10699990B2Integrated circuit device with plating on lead interconnection point and method of forming the deviceSTMICROELECTRONICS SDN BHD·Filed 2018·Granted Jun 30, 2020·0 cites·20 claims
- 0537US10062639B2Integrated circuit device with plating on lead interconnection point and method of forming the deviceSTMICROELECTRONICS SDN BHD·Filed 2014·Granted Aug 28, 2018·0 cites·29 claims
- 0632US2015001697A1Selective treatment of leadframe with anti-wetting agentSTMICROELECTRONICS SDN BHD·Filed 2013·Application pending·0 cites
- 0729US6765378B2Test handler apparatus for SMD (surface mount devices), BGA (ball grid arrays) and CSP (chip scale packages)STMICROELECTRONICS SDN BHD·Filed 2002·Granted Jul 20, 2004·3 cites·23 claims
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