Assignee

SPHERETEK LLC

US·2 granted patents·75 citations·filing 1999–2001

Technology mixB23K2 H05K2 H10W2

Top patents by PatentIndex Score

2 records

0179US6609652B2Ball bumping substrates, particuarly wafersSPHERETEK LLC·Filed 2001·Granted Aug 26, 2003·28 cites·11 claims
0279US6293456B1Methods for forming solder balls on substratesSPHERETEK LLC·Filed 1999·Granted Sep 25, 2001·47 cites·21 claims

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