Assignee
SEKOWSKI DANIEL
US·2 granted patents·6 citations·filing 2009–2012
Top patents by PatentIndex Score
2 records- 0168US9105819B2Method for making an electronic apparatus having an encapsulating layer within and outside of a molded frame overlying a connection arrangement on a circuit boardSEKOWSKI DANIEL·Filed 2012·Granted Aug 11, 2015·2 cites·11 claims
- 0265US8184440B2Electronic apparatus having an encapsulating layer within and outside of a molded frame overlying a connection arrangement on a circuit boardSEKOWSKI DANIEL·Filed 2009·Granted May 22, 2012·4 cites·9 claims
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