Assignee

PLESINGER BORIS

US·1 granted patent·3 citations·filing 1986–1986

Technology mixH05K1 H10W1 Y10S1 Y10T1

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0118US5061547AStructure of conductive layers in multilayer substrates for minimizing blisters and delaminationsPLESINGER BORIS·Filed 1986·Granted Oct 29, 1991·3 cites·3 claims

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