Assignee
KUMMERL STEVEN A
US·2 granted patents·22 citations·filing 2009–2011
Technology mixH10W2
Top patents by PatentIndex Score
2 records- 0193US8569082B2Semiconductor package with a mold material encapsulating a chip and a portion of a lead frameKUMMERL STEVEN A·Filed 2011·Granted Oct 29, 2013·18 cites·9 claims
- 0271US8072770B2Semiconductor package with a mold material encapsulating a chip and a portion of a lead frameKUMMERL STEVEN A·Filed 2009·Granted Dec 6, 2011·4 cites·19 claims
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