Assignee
KOO JUN MO
SG·2 granted patents·179 citations·filing 2011–2011
Top patents by PatentIndex Score
2 records- 0197US9224647B2Semiconductor device and method of forming TSV interposer with semiconductor die and build-up interconnect structure on opposing surfaces of the interposerKOO JUN MO·Filed 2011·Granted Dec 29, 2015·109 cites·14 claims
- 0297US8993377B2Semiconductor device and method of bonding different size semiconductor die at the wafer levelKOO JUN MO·Filed 2011·Granted Mar 31, 2015·70 cites·28 claims
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