Assignee

HAISS EBERHARD

DE·1 granted patent·1 citations·filing 2013–2013

Technology mixG01C1 G01D1 G01P1 H05K1 Y10T1

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1 record

0152US9408319B2Electronic component having a molded component housingHAISS EBERHARD·Filed 2013·Granted Aug 2, 2016·1 cites·16 claims

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