Assignee
GLOBAL ADVANCED PACKAGING TECH
HK·5 granted patents·24 citations·filing 2003–2004
Top patents by PatentIndex Score
5 records- 0164US6937477B2Structure of gold fingersGLOBAL ADVANCED PACKAGING TECH·Filed 2004·Granted Aug 30, 2005·12 cites·5 claims
- 0256US7098524B2Electroplated wire layout for package sawingGLOBAL ADVANCED PACKAGING TECH·Filed 2004·Granted Aug 29, 2006·10 cites·7 claims
- 0339US7095091B2Packaging stacked chips with finger structureGLOBAL ADVANCED PACKAGING TECH·Filed 2004·Granted Aug 22, 2006·1 cites·6 claims
- 0435US7091590B2Multiple stacked-chip packaging structureGLOBAL ADVANCED PACKAGING TECH·Filed 2003·Granted Aug 15, 2006·0 cites·5 claims
- 0525US6933592B2Substrate structure capable of reducing package singular stressGLOBAL ADVANCED PACKAGING TECH·Filed 2003·Granted Aug 23, 2005·1 cites·5 claims
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →