Assignee
ENDICOTT INTERCONECT TECHNOLOG
US·2 granted patents·33 citations·filing 2005–2006
Technology mixH05K2
Top patents by PatentIndex Score
2 records- 0190US7442879B2Circuitized substrate with solder-coated microparticle paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same and method of making said substrateENDICOTT INTERCONECT TECHNOLOG·Filed 2005·Granted Oct 28, 2008·23 cites·40 claims
- 0281US7449381B2Method of making a capacitive substrate for use as part of a larger circuitized substrate, method of making said circuitized substrate and method of making an information handling system including said circuitized substrateENDICOTT INTERCONECT TECHNOLOG·Filed 2006·Granted Nov 11, 2008·10 cites·19 claims
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