Assignee

CUBIC MEMORY

US·1 granted patent·39 citations·filing 1997–1997

Technology mixH01R1 H05K1 H10D1 H10W1 Y02P1

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0172US6124633AVertical interconnect process for silicon segments with thermally conductive epoxy preformCUBIC MEMORY·Filed 1997·Granted Sep 26, 2000·39 cites·21 claims

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