Assignee

CHIP POSITION SYSTEM CO LTD

TW·1 granted patent·0 citations·filing 2021–2021

Technology mixB81B1 B81C1 G01J1 H01L1 H05B1 H10F1

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0144US11894473B2Sensing module and manufacturing method thereofCHIP POSITION SYSTEM CO LTD·Filed 2021·Granted Feb 6, 2024·0 cites·10 claims

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