Assignee
BOYLE ADRIAN
IE·1 granted patent·3 pending applications·3 citations·filing 2003–2012
Top patents by PatentIndex Score
4 records- 0155US8551792B2Dicing a semiconductor waferBOYLE ADRIAN·Filed 2009·Granted Oct 8, 2013·3 cites·24 claims
- 0245US2012264238A1Program controlled dicing of a substrate using a pulsed laser beamBOYLE ADRIAN·Filed 2012·Application pending·0 cites
- 0333US2006249480A1Laser machining using an active assist gasBOYLE ADRIAN·Filed 2004·Application pending·0 cites
- 0429US2006163209A1Laser machiningBOYLE ADRIAN·Filed 2003·Application pending·0 cites
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