Assignee

BLESSING PATRICK

CH·1 granted patent·4 citations·filing 2008–2008

Technology mixH10P1 H10W1 Y10T1

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0162US8166637B2Apparatus for mounting a flip chip on a substrateBLESSING PATRICK·Filed 2008·Granted May 1, 2012·4 cites·4 claims

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