Assignee
BINDRUP RANDY
US·2 granted patents·1 pending application·3 citations·filing 2011–2012
Top patents by PatentIndex Score
3 records- 0163US8637985B2Anti-tamper wrapper interconnect method and a deviceBINDRUP RANDY·Filed 2012·Granted Jan 28, 2014·2 cites·5 claims
- 0259US9431275B2Wire bond through-via structure and methodBINDRUP RANDY·Filed 2011·Granted Aug 30, 2016·1 cites·12 claims
- 0335US2012069528A1Method for Control of Solder Collapse in Stacked Microelectronic StructureBINDRUP RANDY·Filed 2011·Application pending·0 cites
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