Assignee
BAILEY MARK J
0 granted patents·2 pending applications·0 citations·filing 2007–2008
Top patents by PatentIndex Score
2 records- 0147US2009268422A1Scalable electronic package assembly for memory devices and other terminated bus structuresBAILEY MARK J·Filed 2008·Application pending·0 cites
- 0240US2009085155A1Method and apparatus for package-to-board impedance matching for high speed integrated circuitsBAILEY MARK J·Filed 2007·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →