Assignee
BAE HAN JUN
KR·2 granted patents·3 citations·filing 2008–2008
Top patents by PatentIndex Score
2 records- 0163US8072046B2Through-electrode, circuit board having a through-electrode, semiconductor package having a through-electrode, and stacked semiconductor package having the semiconductor chip or package having a through-electrodeBAE HAN JUN·Filed 2008·Granted Dec 6, 2011·3 cites·16 claims
- 0243US8618637B2Semiconductor package using through-electrodes having voidsBAE HAN JUN·Filed 2008·Granted Dec 31, 2013·0 cites·16 claims
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →